Method for using a buffer sheet
The present invention provides a buffer sheet composition including a thermosetting compound, which buffer sheet composition is used for producing a buffer sheet to be interposed between a heating member and an electronic component, when the electronic component is heated by the heating member so as to mount the electronic component on a substrate, as well as a buffer sheet including a thermosetting composition layer obtained by forming the buffer sheet composition into the form of a sheet.
1 . A method of producing an electronic component device, the method comprising:
providing an electronic component and a substrate, wherein the electronic component has a surface facing the substrate, the substrate has a surface facing the electronic component, and solder bumps are formed on one of said surfaces;
applying a curable underfill material to one or both of the electronic component surface facing the substrate and the substrate surface facing the electronic component;
applying pressure to the electronic component and the substrate with the solder bumps interposed between the electronic component and the substrate, so that a gap between the electronic component and the substrate is filled with the curable underfill material;
providing a buffer sheet comprising a dried layer of a curable thermosetting composition, wherein the curable thermosetting composition comprises at least one thermosetting compound;
interposing the buffer sheet between a heating member and the electronic component; and
subsequently curing the dried layer of the buffer sheet and the curable underfill material with heat from the heating member.
2 . The method according to claim 1 , wherein the at least one thermosetting compound comprises an epoxy resin.
3 . The method according to claim 1 , wherein the curable thermosetting composition further comprises one or more elements selected from the group consisting of a curing agent, an inorganic filler, a curing accelerator, and a solvent.
4 . The method according to claim 1 , wherein the at least one thermosetting compound comprises a (meth)acrylate compound and the (meth)acrylate compound is selected from the group consisting of erythritol-type poly (meth)acrylate compounds, glycidyl ether-type (meth)acrylate compounds, bisphenol A-type di(meth)acrylate compounds, cyclodecane-type di(meth)acrylate compounds, methylol-type (meth)acrylate compounds, dioxane-type di(meth)acrylate compounds, bisphenol F-type (meth)acrylate compounds, dimethylol-type (meth)acrylate compounds, isocyanuric acid-type di(meth)acrylate compounds, and trimethylol-type tri(meth)acrylate compounds.
5 . The method according to claim 1 , wherein the curable thermosetting composition further comprises a thermoplastic resin.
6 . The method according to claim 5 , wherein the thermoplastic resin is selected from the group consisting of acrylic resins, styrene resins, butadiene resins, imide resins, and amide resins.
7 . The method according to claim 1 , wherein the at least one thermosetting compound comprises trimethylolpropane triacrylate.
8 . The method according to claim 1 , wherein the curable thermosetting composition further comprises a polymerization initiator.
9 . The method according to claim 1 , wherein the curable thermosetting composition further comprises a curing agent.
10 . The method according to claim 1 , wherein the buffer sheet further comprises a support provided on or above one surface of the dried layer or the buffer sheet further comprises supports provided on both surfaces of the dried layer.
11 . The method according to claim 1 , wherein the dried layer of the buffer sheet has an average thickness of 20 μm or more.