IP Library › Assignment 063016/0952
Patent Assignment
Reel/Frame 063016/0952

Change of Name

Recorded: 2023-03-17 Pages: 11
Assignor
SHOWA DENKO MATERIALS CO., LTD.
Executed: 2023-01-01
Assignee
RESONAC CORPORATION
9-2, MARUNOUCHI 1-CHOME, CHIYODA-KU, TOKYO, JAPAN
Covered Properties (20)
Epoxy Resin, Epoxy Resin Composition, Epoxy Resin Cured Product and Composite Material
Application: 17/274,762 →
Publication: US US20220049046A1
Epoxy Resin, Epoxy Resin Composition, Epoxy Resin Cured Product and Composite Material
Application: 17/274,763 →
Publication: US US20220049047A1
Epoxy Resin B-Stage Film, Epoxy Resin Cured Film and Method of Producing Epoxy Resin Cured Film
Application: 17/312,401 →
Publication: US US20220025107A1
Negative Electrode Material for Lithium Ion Secondary Battery, Negative Electrode for Lithium Ion Secondary Battery, and Lithium Ion Secondary Battery
Application: 17/420,142 →
Publication: US US20220069303A1
Negative Electrode Material for Lithium Ion Secondary Battery, Method of Producing Negative Electrode Material for Lithium Ion Secondary Battery, Negative Electrode for Lithium Ion Secondary Battery, and Lithium Ion Secondary Battery
Application: 17/420,143 →
Publication: US US20220085370A1
Epoxy Resin, Epoxy Resin Composition, Epoxy Resin Cured Product and Composite Material
Application: 17/598,305 →
Publication: US US20220162374A1
Negative Electrode Material for Lithium Ion Secondary Battery, Negative Electrode for Lithium Ion Secondary Battery, and Lithium Ion Secondary Battery
Application: 17/631,857 →
Publication: US US20220285684A1
Negative Electrode Material for Lithium-Ion Secondary Battery and Method of Producing Same, Negative Electrode for Lithium-Ion Secondary Battery, and Lithium-Ion Secondary Battery
Application: 17/796,253 →
Publication: US US20230084916A1
Thermally Conductive Sheet and Method of Manufacturing Semiconductor Device
Application: 17/818,044 →
Publication: US US20220384300A1
Method of Manufacturing Semiconductor Device, Thermally Conductive Sheet, and Method of Manufacturing Thermally Conductive Sheet
Application: 17/819,391 →
Publication: US US20220392825A1
Photosensitive Resin Composition, Method of Producing Patterned Cured Product Using the Same, and Cured Product of Photosensitive Resin Composition
Application: 17/823,426 →
Publication: US US20230259026A1
Method of Measuring Physical Properties, Method of Evaluating Member, Method of Manufacturing Electronic Component Device, Method of Manufacturing Material for Electronic Component Device, and Physical Property Measurement System
Application: 17/926,998 →
Publication: US US20230204530A1
Method of Manufacturing Anode Material for Lithium-Ion Secondary Battery, and Method of Manufacturing Lithium-Ion Secondary Battery
Application: 18/008,971 →
Publication: US US20230246162A1
Anode Material for Lithium-Ion Secondary Battery, Anode for Lithium-Ion Secondary Battery, and Lithium-Ion Secondary Battery
Application: 18/008,976 →
Publication: US US20230275227A1
Method for Using a Buffer Sheet
Application: 18/052,536 →
Publication: US US20230095879A1
Resin Composition, Resin Member, Resin Sheet, B-Stage Sheet, C-Stage Sheet, Metal Foil with Resin, Metal Substrate, and Power Semiconductor Device
Application: 17/059,253 →
Publication: US US20210206906A1
Negative Electrode Material for Lithium-Ion Secondary Battery, Negative Electrode for Lithium-Ion Secondary Battery, Lithium-Ion Secondary Battery and Method of Producing Negative Electrode for Lithium-Ion Secondary Battery
Application: 17/258,746 →
Publication: US US20210273224A1
Negative Electrode Material for Lithium-Ion Secondary Cell, Method for Manufacturing Negative Electrode Material for Lithium-Ion Secondary Cell, Negative Electrode Material Slurry for Lithium-Ion Secondary Cell, Negative Electrode for Lithium-Ion Secondary Cell, and Lithium-Ion Secondary Cell
Application: 17/295,888 →
Publication: US US20220131147A1
Method of Manufacturing Semiconductor Device, Thermally Conductive Sheet, and Method of Manufacturing Thermally Conductive Sheet
Application: 17/269,523 →
Publication: US US20210183733A1
Thermally Conductive Sheet and Method of Manufacturing Semiconductor Device
Application: 17/269,524 →
Publication: US US20210183734A1
Related Assignments (24)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Dec 1, 2020
From: KIGUCHI, KAZUYA; NISHIYAMA, TOMOO; INOUE, HIDETOSHI; AMANO, YOSHIHIRO
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 054497/0185 →
Assignment of Assignor's Interest Jan 19, 2021
From: HOSHI, KENTO; UCHIYAMA, YOSHINORI
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 054947/0562 →
Assignment of Assignor's Interest Mar 9, 2021
From: KOBUNE, MIKA; YAJIMA, MICHIAKI
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 055526/0211 →
Assignment of Assignor's Interest Mar 9, 2021
From: KOBUNE, MIKA; YAJIMA, MICHIAKI
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 055526/0206 →
Assignment of Assignor's Interest Mar 30, 2021
From: MARUYAMA, NAOKI; HIGASHIUCHI, TOMOKO; FUKUDA, KAZUMASA; KATAGI, HIDEYUKI
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 055760/0960 →
Assignment of Assignor's Interest Mar 30, 2021
From: KATAGI, HIDEYUKI; HIGASHIUCHI, TOMOKO; NAKAMURA, YUKI; FUKUDA, KAZUMASA
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 055760/0947 →
Assignment of Assignor's Interest Jun 18, 2021
From: TANAKA, SHINGO; TAKEZAWA, YOSHITAKA; KIGUCHI, KAZUYA
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 056581/0625 →
Assignment of Assignor's Interest Jul 2, 2021
From: TSUCHIYA, HIDEYUKI; SATOH, TSUTOMU
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 056740/0235 →
Assignment of Assignor's Interest Jul 7, 2021
From: HOSHI, KENTO; OKAMURA, WAKANA; KUBOTA, TAKASHI
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 056768/0566 →
Assignment of Assignor's Interest Jul 7, 2021
From: OKAMURA, WAKANA; HOSHI, KENTO
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 056768/0563 →
Assignment of Assignor's Interest Mar 30, 2022
From: MIYAUCHI, TAKAYUKI; SATO, TAKESHI; IKEDA, YUSUKE; KAGAWA, TAKUYA
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 059435/0812 →
Assignment of Assignor's Interest Sep 5, 2022
From: ABE, SHINICHIRO; MITSUKURA, KAZUYUKI; TOBA, MASAYA; IMAZU, YUKI
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 060987/0348 →
Assignment of Assignor's Interest Sep 20, 2022
From: KOBUNE, MIKA; YAJIMA, MICHIAKI
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 061143/0341 →
Assignment of Assignor's Interest Sep 20, 2022
From: KOBUNE, MIKA; YAJIMA, MICHIAKI
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 061143/0338 →
Assignment of Assignor's Interest Sep 22, 2022
From: TSUCHIYA, HIDEYUKI; TOKUDA, YOSHIYUKI; SUGA, KEITA
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 061503/0929 →
Assignment of Assignor's Interest Nov 29, 2022
From: NOMA, HIROKAZU
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 061899/0434 →
Assignment of Assignor's Interest Dec 15, 2022
From: KOSEKI, YUTA; FUJIMOTO, DAISUKE; YAMADA, KUMPEI; SUZUKI, NAOYA
To: HITACHI CHEMICAL COMPANY, LTD.
Reel/Frame 062098/0424 →
Assignment of Assignor's Interest Dec 20, 2022
From: TSUCHIYA, HIDEYUKI; SUGA, KEITA
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 062151/0900 →
Change of Name Dec 22, 2022
From: HITACHI CHEMICAL CO., LTD.
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 062205/0946 →
Assignment of Assignor's Interest Jan 26, 2023
From: KATAGI, HIDEYUKI; NAKAMURA, YUKI; FUKUDA, KAZUMASA; TIAN, LIN
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 062512/0739 →
Assignment of Assignor's Interest Mar 1, 2023
From: MATSUMOTO, YOSHIYUKI; SAKAMOTO, TAKASHI; UCHIYAMA, YOSHINORI
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 062899/0253 →
Corrective Assignment to Correct the Assignee's Address Previously Recorded on Reel 063016 Frame 0952. Assignor(S) Hereby Confirms the Change of Name. Apr 17, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 063348/0944 →
Change of Address Feb 9, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066547/0677 →
Change of Address Feb 14, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066599/0037 →