IP Library Assignment 055760/0960
Patent Assignment
Reel/Frame 055760/0960

Assignment of Assignor's Interest

Recorded: 2021-03-30 Pages: 5
Assignors
MARUYAMA, NAOKI
Executed: 2021-03-03
HIGASHIUCHI, TOMOKO
Executed: 2021-03-08
FUKUDA, KAZUMASA
Executed: 2021-03-09
KATAGI, HIDEYUKI
Executed: 2021-03-10
NAKAMURA, YUKI
Executed: 2021-03-05
TAKEZAWA, YOSHITAKA
Executed: 2021-03-09
Assignee
SHOWA DENKO MATERIALS CO., LTD.
9-2, MARUNOUCHI 1-CHOME, CHIYODA-KU, TOKYO, 100-6606, JAPAN
Covered Property (1)
Epoxy Resin, Epoxy Resin Composition, Epoxy Resin Cured Product and Composite Material
Application: 17/274,762 →
Publication: US 2022/0049046
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name Mar 17, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 063016/0952 →
Corrective Assignment to Correct the Assignee's Address Previously Recorded on Reel 063016 Frame 0952. Assignor(S) Hereby Confirms the Change of Name. Apr 17, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 063348/0944 →
Change of Address Feb 9, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066547/0677 →