Patent Assignment
Reel/Frame 054497/0185
Assignment of Assignor's Interest
Recorded: 2020-12-01
Pages: 17
Assignors
KIGUCHI, KAZUYA
Executed: 2020-11-09
NISHIYAMA, TOMOO
Executed: 2020-11-06
INOUE, HIDETOSHI
Executed: 2020-11-11
AMANO, YOSHIHIRO
Executed: 2020-11-06
FUJIMOTO, DAISUKE
Executed: 2020-11-09
Assignee
SHOWA DENKO MATERIALS CO., LTD.
9-2, MARUNOUCHI 1-CHOME, CHIYODA-KU, TOKYO, 100-6606, JAPAN
Covered Property
(1)
Resin Composition, Resin Member, Resin Sheet, B-Stage Sheet, C-Stage Sheet, Metal Foil with Resin, Metal Substrate, and Power Semiconductor Device
Application:
17/059,253 →
Publication:
US 2021/0206906
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name
Mar 17, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 063016/0952 →
Corrective Assignment to Correct the Assignee's Address Previously Recorded on Reel 063016 Frame 0952. Assignor(S) Hereby Confirms the Change of Name.
Apr 17, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 063348/0944 →
Change of Address
Feb 9, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066547/0677 →