Patent Assignment
Reel/Frame 055526/0211
Assignment of Assignor's Interest
Recorded: 2021-03-09
Pages: 3
Assignee
SHOWA DENKO MATERIALS CO., LTD.
9-2, MARUNOUCHI 1-CHOME, CHIYODA-KU, TOKYO, 100-6606, JAPAN
Covered Property
(1)
Method of Manufacturing Semiconductor Device, Thermally Conductive Sheet, and Method of Manufacturing Thermally Conductive Sheet
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name
Mar 17, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 063016/0952 →
Corrective Assignment to Correct the Assignee's Address Previously Recorded on Reel 063016 Frame 0952. Assignor(S) Hereby Confirms the Change of Name.
Apr 17, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 063348/0944 →
Change of Address
Feb 14, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066599/0037 →