Patent Assignment
Reel/Frame 060987/0348
Assignment of Assignor's Interest
Recorded: 2022-09-05
Pages: 8
Assignors
ABE, SHINICHIRO
Executed: 2022-07-05
MITSUKURA, KAZUYUKI
Executed: 2022-07-05
TOBA, MASAYA
Executed: 2022-07-05
IMAZU, YUKI
Executed: 2022-07-05
Assignee
SHOWA DENKO MATERIALS CO., LTD.
9-2, MARUNOUCHI 1-CHOME, CHIYODA-KU, TOKYO, 100-6606, JAPAN
Covered Property
(1)
Photosensitive Resin Composition, Method of Producing Patterned Cured Product Using the Same, and Cured Product of Photosensitive Resin Composition
Application:
17/823,426 →
Publication:
US 2023/0259026
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name
Mar 17, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 063016/0952 →
Corrective Assignment to Correct the Assignee's Address Previously Recorded on Reel 063016 Frame 0952. Assignor(S) Hereby Confirms the Change of Name.
Apr 17, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 063348/0944 →
Change of Address
Feb 9, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066547/0677 →