Patent Assignment
Reel/Frame 061899/0434
Assignment of Assignor's Interest
Recorded: 2022-11-29
Pages: 3
Assignor
NOMA, HIROKAZU
Executed: 2022-11-02
Assignee
SHOWA DENKO MATERIALS CO., LTD.
9-2, MARUNOUCHI 1-CHOME, CHIYODA-KU, TOKYO, 100-6606, JAPAN
Covered Property
(1)
Method of Measuring Physical Properties, Method of Evaluating Member, Method of Manufacturing Electronic Component Device, Method of Manufacturing Material for Electronic Component Device, and Physical Property Measurement System
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name
Mar 17, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 063016/0952 →
Corrective Assignment to Correct the Assignee's Address Previously Recorded on Reel 063016 Frame 0952. Assignor(S) Hereby Confirms the Change of Name.
Apr 17, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 063348/0944 →
Change of Address
Feb 9, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066547/0677 →