Patent Assignment
Reel/Frame 055760/0947
Assignment of Assignor's Interest
Recorded: 2021-03-30
Pages: 5
Assignors
KATAGI, HIDEYUKI
Executed: 2021-03-10
HIGASHIUCHI, TOMOKO
Executed: 2021-03-08
NAKAMURA, YUKI
Executed: 2021-03-05
FUKUDA, KAZUMASA
Executed: 2021-03-09
MARUYAMA, NAOKI
Executed: 2021-03-03
TIAN, LIN
Executed: 2021-03-15
Assignee
SHOWA DENKO MATERIALS CO., LTD.
9-2, MARUNOUCHI 1-CHOME, CHIYODA-KU, TOKYO, 100-6606, JAPAN
Covered Property
(1)
Epoxy Resin, Epoxy Resin Composition, Epoxy Resin Cured Product and Composite Material
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name
Mar 17, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 063016/0952 →
Corrective Assignment to Correct the Assignee's Address Previously Recorded on Reel 063016 Frame 0952. Assignor(S) Hereby Confirms the Change of Name.
Apr 17, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 063348/0944 →
Change of Address
Feb 14, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066599/0037 →