Patent Assignment
Reel/Frame 049518/0248
Assignment of Assignor's Interest
Recorded: 2019-06-19
Pages: 8
Assignees
SHOWA DENKO K.K.
13-9, SHIBADAIMON 1-CHOME, MINATO-KU, TOKYO, 105-8518, JAPAN
DENSO CORPORATION
1-1, SHOWA-CHO, KARIYA-SHI, AICHI, 448-8661, JAPAN
Covered Property
(1)
SiC WAFER AND MANUFACTURING METHOD OF SiC WAFER
Application:
16/471,061 →
Publication:
US 2020/0020777
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name
Jun 23, 2023
From: SHOWA DENKO K.K.
To: RESONAC CORPORATION
Reel/Frame 064082/0513 →
Change of Address
Feb 7, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066515/0515 →
Change of Address
Feb 9, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066547/0677 →
Assignment of Assignor's Interest
Feb 16, 2024
From: DENSO CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066485/0480 →