Patent Assignment
Reel/Frame 066515/0515
Change of Address
Recorded: 2024-02-07
Pages: 7
Assignor
RESONAC CORPORATION
Executed: 2023-10-02
Assignee
RESONAC CORPORATION
9-1, HIGASHI-SHIMBASHI 1-CHOME, MINATO-KU, TOKYO, JAPAN
Covered Property
(1)
SiC WAFER AND MANUFACTURING METHOD OF SiC WAFER
Application:
16/471,061 →
Publication:
US 2020/0020777
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Jun 19, 2019
From: FUJIKAWA, YOHEI; TAKABA, HIDETAKA
To: SHOWA DENKO K.K.; DENSO CORPORATION
Reel/Frame 049518/0248 →
Change of Name
Jun 23, 2023
From: SHOWA DENKO K.K.
To: RESONAC CORPORATION
Reel/Frame 064082/0513 →
Change of Address
Feb 9, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066547/0677 →
Assignment of Assignor's Interest
Feb 16, 2024
From: DENSO CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066485/0480 →