IP Library Granted Patent US 12,037,249
Granted Patent B2
US 12,037,249 · App. 18/175,934 · Granted Jul 16, 2024

SiC substrate and SiC ingot

Inventors: Masato Ito (Ichihara, JP); Hiromasa Suo (Ichihara, JP)
Assignee: Resonac Corporation
C01B32/956C01P2006/60C01P2006/80
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Quick Facts
Patent No.
US 12,037,249
App. No.
18/175,934
Granted
Jul 16, 2024
Kind
B2
Abstract

In a SiC substrate according to the present embodiment, between any two adjacent measurement points among a plurality of first measurement points including a center and a plurality of measurement points separated from the center by 10 mm in an [11-20] direction or [−1-120] direction, a difference in absorption coefficient for light having a wavelength of 1064 nm is 0.25 cm −1 or less.

Claims (14)

1. A SiC substrate, wherein, between any two adjacent measurement points among a plurality of first measurement points including a center and a plurality of measurement points separated from the center by 10 mm in an [11-20] direction or [−1-120] direction, a difference in absorption coefficient for light having a wavelength of 1064 nm is 0.25 cm −1 or less.

2. The SiC substrate according to claim 1 ,

wherein a plurality of second measurement points separated from each of the plurality of first measurement points by 10 mm in a [1-100] direction or [−1100] direction are further provided, and

wherein, between any two adjacent measurement points among the plurality of first measurement points and the plurality of second measurement points, a difference in absorption coefficient for light having a wavelength of 1064 nm is 0.25 cm −1 or less.

3. The SiC substrate according to claim 1 , wherein, between any two measurement points separated from each other by 10 mm, a difference in absorption coefficient for light having a wavelength of 1064 nm is 0.25 cm −1 or less.

4. The SiC substrate according to claim 1 , wherein a diameter of the SiC substrate is 149 mm or more.

5. The SiC substrate according to claim 1 , wherein a diameter of the SiC substrate is 199 mm or more.

6. The SiC substrate according to claim 1 , wherein a maximum absorption coefficient of the SiC substrate for light having a wavelength of 1064 nm is 3.00 cm −1 or less.

7. The SiC substrate according to claim 1 , wherein a maximum absorption coefficient of the SiC substrate for light having a wavelength of 1064 nm is 2.75 cm −1 or less.

8. The SiC substrate according to claim 1 , wherein the substrate includes a portion other than a high nitrogen concentration region called a facet.

9. The SiC substrate according to claim 8 , wherein a dopant intentionally added for determining a conductivity type is nitrogen.

10. A SiC ingot, wherein, when cutting out a SiC substrate therefrom and evaluating a cut surface thereof, between any two adjacent measurement points among a plurality of first measurement points including a center and a plurality of measurement points separated from the center by 10 mm in an [11-20] direction or [−1-120] direction, a difference in absorption coefficient for light having a wavelength of 1064 nm is 0.25 cm −1 or less.

11. The SiC ingot according to claim 10 , wherein the ingot includes a portion other than a high nitrogen concentration region called a facet.

12. The SiC ingot according to claim 10 , wherein a dopant intentionally added for determining a conductivity type is nitrogen.

Assignments (2)
CHANGE OF ADDRESS Recorded Feb 9, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066547/0677 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 13, 2023
From: ITO, MASATO; SUO, HIROMASA
To: RESONAC CORPORATION
Reel/Frame 064897/0820 →