Patent Assignment
Reel/Frame 062668/0794
Change of Name
Recorded: 2023-02-07
Pages: 32
Assignor
HITACHI CHEMICAL COMPANY, LTD.
Executed: 2020-10-01
Assignee
SHOWA DENKO MATERIALS CO., LTD.
1-9-2, MARUNOUCHI, CHIYODA-KU, TOKYO, JAPAN
Covered Properties
(4)
Epoxy Resin, Epoxy Resin Composition, Epoxy Resin Cured Product, and Composite Material
Production Methods for Glassy Liquid-Crystalline Epoxy Resin and Glassy Liquid-Crystalline Epoxy Resin Composition, Storage Methods for Liquid-Crystalline Epoxy Resin and Liquid-Crystalline Epoxy Resin Composition, Glassy Liquid-Crystalline Epoxy Resin and Glassy Liquid-Crystalline Epoxy Resin Composition, Liquid-Crystalline Epoxy Resin and Liquid-Crystalline Epoxy Resin Composition, and Production Method for Cured Epoxy Resin
Photosensitive Resin Composition, Dry Film Using Same, Printed Wiring Board, and Printed Wiring Board Manufacturing Method
Cured Epoxy Resin Material, Epoxy Resin Composition, Molded Article, and Composite Material
Related Assignments
(8)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
May 2, 2019
From: MARUYAMA, NAOKI; HIGASHIUCHI, TOMOKO; FUKUDA, KAZUMASA; YOSHIDA, YUKA
To: HITACHI CHEMICAL COMPANY, LTD.
Reel/Frame 049061/0815 →
Assignment of Assignor's Interest
Jul 11, 2019
From: TANAKA, SHINGO; HIGASHIUCHI, TOMOKO; MARUYAMA, NAOKI; FUKUDA, KAZUMASA
To: HITACHI CHEMICAL COMPANY, LTD.
Reel/Frame 049728/0960 →
Assignment of Assignor's Interest
Feb 10, 2020
From: KOMURO, NOBUHITO; DAIJIMA, YUTA; MARUYAMA, TETSUYA; IRIZAWA, SHINJI
To: HITACHI CHEMICAL COMPANY, LTD.
Reel/Frame 051768/0106 →
Assignment of Assignor's Interest
May 14, 2020
From: FUKUDA, KAZUMASA; TAKEZAWA, YOSHITAKA; MARUYAMA, NAOKI; YOSHIDA, YUKA
To: HITACHI CHEMICAL COMPANY, LTD.
Reel/Frame 052663/0765 →
Change of Name
Feb 9, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 062636/0323 →
Corrective Assignment to Correct the the Address of the Assignee Previously Recorded at Reel: 06236 Frame: 0323. Assignor(S) Hereby Confirms the Assignment.
Mar 16, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 063193/0416 →
Change of Address
Feb 9, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066547/0677 →
Change of Address
Feb 14, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066599/0037 →