IP Library Granted Patent US 11,840,600
Granted Patent B2
US 11,840,600 · App. 16/642,532 · Granted Dec 12, 2023

Cured epoxy resin material, epoxy resin composition, molded article, and composite material

Inventors: Kazumasa Fukuda (Tokyo, JP); Yoshitaka Takezawa (Tokyo, JP); Naoki Maruyama (Tokyo, JP); Yuka Yoshida (Tokyo, JP); Tomoko Higashiuchi (Tokyo, JP)
Assignee: RESONAC CORPORATION
C08G59/245C08G59/4085C08G59/5033C08L63/00C08L2201/08C08L2203/30
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Quick Facts
Patent No.
US 11,840,600
App. No.
16/642,532
Granted
Dec 12, 2023
Kind
B2
Abstract

A cured epoxy resin, which is a cured product of an epoxy compound having a mesogenic structure and a curing agent having a molecular chain or a flexible backbone with a molecular weight of 100 or more, the cured epoxy resin having a smectic structure; a cured epoxy resin, which is a cured product of an epoxy compound having a mesogenic structure and a curing agent having a molecular chain or a flexible backbone with a molecular weight of 100 or more, the cured epoxy resin not having a smectic structure; an epoxy resin composition, comprising an epoxy compound having a mesogenic structure and a curing agent having a molecular chain with a molecular weight of 100 or more; and an epoxy resin composition, comprising an epoxy compound having a mesogenic structure and a curing agent having a flexible backbone with a molecular weight of 100 or more.

Claims (12)

1. A cured product of an epoxy resin composition, wherein the epoxy resin composition comprises an epoxy resin and an amine curing agent;

wherein the epoxy resin is capable of forming a cured material having a smectic structure and comprises: an epoxy multimer, which is a reaction product of an epoxy monomer and at least one of a dihydroxybenzene compound and a diaminobenzene compound; and an unreacted epoxy monomer;

wherein the epoxy monomer and the unreacted epoxy monomer are represented by formula (M):

wherein each of R 1 to R 4 independently represents a hydrogen atom or an alkyl group having 1 to 3 carbon atoms;

wherein the amine curing agent is a compound that has at least two aromatic rings to which an amino group is bonded and a molecular chain or a flexible backbone between the aromatic rings, with each of the molecular chain and the flexible backbone having a molecular weight of 100 or more; and

wherein the cured product does not have a smectic structure and does have a total light transmittance of higher than 60%.

2. The cured product according to claim 1 , wherein the molecular chain or the flexible backbone includes at least one selected from the group consisting of an alkylene group, an alkyleneoxy group and a siloxane bond.

3. The cured product according to claim 1 , wherein the curing agent is a compound that has two aromatic rings to which an amino group is bonded and a molecular chain or a flexible backbone between the aromatic rings, with each of the molecular chain and the flexible backbone having a molecular weight of 100 or more.

4. The cured product according to claim 1 , wherein the curing agent is poly(1,4-butandiol)bis(4-aminobenzoic acid).

5. A molded article, comprising the cured product according to claim 1 .

6. A composite material, comprising the cured product according to claim 1 and a reinforcing material.

7. The composite material according to claim 6 , having at least one layer that comprises the cured product, and at least one layer that comprises the reinforcing material.

Assignments (5)
CHANGE OF ADDRESS Recorded Feb 14, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066599/0037 →
CORRECTIVE ASSIGNMENT TO CORRECT THE THE ADDRESS OF THE ASSIGNEE PREVIOUSLY RECORDED AT REEL: 06236 FRAME: 0323. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT. Recorded Mar 16, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 063193/0416 →
CHANGE OF NAME Recorded Feb 9, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 062636/0323 →
CHANGE OF NAME Recorded Feb 7, 2023
From: HITACHI CHEMICAL COMPANY, LTD.
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 062668/0794 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 14, 2020
From: FUKUDA, KAZUMASA; TAKEZAWA, YOSHITAKA; MARUYAMA, NAOKI; YOSHIDA, YUKA; HIGASHIUCHI, TOMOKO
To: HITACHI CHEMICAL COMPANY, LTD.
Reel/Frame 052663/0765 →
Continuity (1)
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