Patent Assignment
Reel/Frame 051768/0106
Assignment of Assignor's Interest
Recorded: 2020-02-10
Pages: 8
Assignors
KOMURO, NOBUHITO
Executed: 2020-01-30
DAIJIMA, YUTA
Executed: 2020-01-30
MARUYAMA, TETSUYA
Executed: 2020-01-30
IRIZAWA, SHINJI
Executed: 2020-01-30
OOSAKI, SINYA
Executed: 2020-01-30
Assignee
HITACHI CHEMICAL COMPANY, LTD.
9-2 MARUNOUCHI 1-CHOME, CHIYODA-KU, 100-6606, JAPAN
Covered Property
(1)
Photosensitive Resin Composition, Dry Film Using Same, Printed Wiring Board, and Printed Wiring Board Manufacturing Method
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name
Feb 7, 2023
From: HITACHI CHEMICAL COMPANY, LTD.
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 062668/0794 →
Change of Name
Feb 9, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 062636/0323 →
Corrective Assignment to Correct the the Address of the Assignee Previously Recorded at Reel: 06236 Frame: 0323. Assignor(S) Hereby Confirms the Assignment.
Mar 16, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 063193/0416 →
Change of Address
Feb 9, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066547/0677 →