Inorganic particle dispersion resin composition and manufacturing method of inorganic particle dispersion resin composition
An inorganic particle dispersion resin composition, containing: a resin; and inorganic particles, in which the inorganic particles include silica-covered aluminum nitride particles and alumina particles, and the silica-covered aluminum nitride particles include aluminum nitride particles and a silica film covering surfaces of the aluminum nitride particles. A total content of the inorganic particles is preferably in a range of greater than or equal to 60.0 volume % and less than or equal to 85.0 volume %.
1. A manufacturing method of an inorganic particle dispersion resin composition, the inorganic particle dispersion resin composition, containing:
a resin; and
inorganic particles,
wherein the inorganic particles include silica-covered aluminum nitride particles and alumina particles, and
the silica-covered aluminum nitride particles include aluminum nitride particles and a silica film covering surfaces of the aluminum nitride particles,
the method comprising:
a particle manufacturing step of manufacturing the silica-covered aluminum nitride particles; and
a mixing step of mixing the inorganic particles including the silica-covered aluminum nitride particles obtained in the particle manufacturing step and the alumina particles with the resin,
wherein the particle manufacturing step includes a first step of covering the surfaces of the aluminum nitride particles with an organic silicone compound having a structure represented by Formula (1) described below, and
a second step of heating the aluminum nitride particles covered with the organic silicone compound at a temperature of higher than or equal to 300° C. and lower than or equal to 800° C.,
wherein the organic silicone compound comprises at least one of a compound represented by Formula (2) described below or a compound represented by Formula (3) described below,
in Formula (1), R is an alkyl group having carbon atoms of less than or equal to 4,
in Formula (2), R1 and R2 are each independently a hydrogen atom or a methyl group, at least one of R1 and R2 is a hydrogen atom, and m is an integer of 0 to 10, and
in Formula (3), n is an integer of 3 to 6, and
in the inorganic particle dispersion resin composition, a content of the alumina particles in the inorganic particles is greater than or equal to 57.0 volume % and less than or equal to 80 volume %.
2. The manufacturing method of the inorganic particle dispersion resin composition according to claim 1 ,
wherein in the inorganic particle dispersion resin composition, a total content of the inorganic particles is in a range of greater than or equal to 60.0 volume % and less than or equal to 85.0 volume %.
3. The manufacturing method of the inorganic particle dispersion resin composition according to claim 1 ,
wherein the resin is a curable silicone resin.
4. The manufacturing method of the inorganic particle dispersion resin composition according to claim 3 ,
wherein a thermal conductivity of the inorganic particle dispersion resin composition in which the curable silicone resin is cured is greater than or equal to 5.0 W/(m·K).
5. The manufacturing method of the inorganic particle dispersion resin composition according to claim 1 ,
wherein in the silica-covered aluminum nitride particles, a content of silicon atoms is greater than or equal to 100 ppm by mass and less than or equal to 5000 ppm by mass.