Epoxy resin composition, and printed circuit board using same

1. An epoxy resin composition comprising:

an epoxy compound represented by the following Formula 1;

a curing agent comprising diaminodiphenyl sulfone; and

an inorganic filler,

wherein the inorganic filler comprises alumina (Al 2 O 3 ), aluminum nitride (AlN), and boron nitride (BN):

wherein each of R 1 to R 14 is independently selected from the group consisting of H, Cl, Br, F, a C 1 -C 3 alkyl, a C 2 -C 3 alkene, and a C 2 -C 3 alkyne, and

each of m and n is 1, 2 or 3,

wherein a weight ratio of the alumina, the aluminum nitride, and the boron nitride is in a range of 1:0.33 to 2.5:0.33 to 0.5.

2. The epoxy resin composition of claim 1 , wherein the epoxy compound comprises an epoxy compound represented by the following Formula 2:

3. The epoxy resin composition of claim 1 , wherein each of m and n is 2 or 3.

4. The epoxy resin composition of claim 3 , wherein each of m and n is 3.

5. The epoxy resin composition of claim 1 , wherein the epoxy compound of Formula 1, the curing agent, and the inorganic filler are included at contents of 3 to 40% by weight, 0.5 to 30% by weight, and 30 to 96.5% by weight, respectively, based on the total weight of the epoxy resin composition.

6. The epoxy resin composition of claim 1 , further comprising an amorphous epoxy compound.

7. The epoxy resin composition of claim 1 , further comprising phenoxy.

8. A printed circuit board comprising:

a metal plate,

an insulating layer formed on the metal plate; and

a circuit pattern formed on the insulating layer,

wherein the insulating layer is made of the epoxy resin composition defined in claim 1 .

9. The printed circuit board of claim 8 , wherein each of m and n is 2 or 3.

10. The printed circuit board of claim 9 , wherein each of m and n is 3.