Patent Assignment
Reel/Frame 051152/0234
Assignment of Assignor's Interest
Recorded: 2019-12-02
Pages: 5
Assignors
INOUE, HIDETOSHI
Executed: 2019-11-15
MATSUZAKI, TAKAYUKI
Executed: 2019-11-21
TAKAHASHI, HISATO
Executed: 2019-11-21
KAMIMURA, TSUYOSHI
Executed: 2019-11-15
YOSHII, HARUYUKI
Executed: 2019-11-12
Assignees
HITACHI CHEMICAL COMPANY, LTD.
9-2, MARUNOUCHI 1-CHOME, CHIYODA-KU, TOKYO, 100-6606, JAPAN
NAMICS CORPORATION
3993, NIGORIKAWA, KITA-KU, NIIGATA-SHI, NIIGATA, 950-3131, JAPAN
Covered Property
(1)
Liquid Resin Composition for Compression Molding and Electronic Component Apparatus
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name
Nov 18, 2022
From: HITACHI CHEMICAL CO., LTD.
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 061967/0116 →
Change of Name
Mar 6, 2023
From: HITACHI CHEMICAL COMPANY, LTD.
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 062956/0668 →
Change of Name
Mar 7, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 062968/0065 →
Change of Address
Feb 9, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066547/0677 →