Patent Assignment
Reel/Frame 061967/0116
Change of Name
Recorded: 2022-11-18
Pages: 32
Assignor
HITACHI CHEMICAL CO., LTD.
Executed: 2020-10-01
Assignee
SHOWA DENKO MATERIALS CO., LTD.
1-9-2, MARUNOUCHI, CHIYODA-KU, TOKYO, JAPAN
Covered Property
(1)
Liquid Resin Composition for Compression Molding and Electronic Component Apparatus
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Dec 2, 2019
From: INOUE, HIDETOSHI; MATSUZAKI, TAKAYUKI; TAKAHASHI, HISATO; KAMIMURA, TSUYOSHI
To: HITACHI CHEMICAL COMPANY, LTD.; NAMICS CORPORATION
Reel/Frame 051152/0234 →
Change of Name
Mar 6, 2023
From: HITACHI CHEMICAL COMPANY, LTD.
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 062956/0668 →
Change of Name
Mar 7, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 062968/0065 →
Change of Address
Feb 9, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066547/0677 →