Method for producing wiring board, and wiring board
A method for producing a wiring board, including: a step of pretreating the surface of a metal layer exposed into an opening by bringing the surface into contact with a pretreatment liquid at a predetermined pretreatment temperature; and a step of forming a copper plating layer on the metal layer by electrolytic plating. The resist layer and the pretreatment liquid are selected such that a mass change rate of the resist layer when the resist layer before being exposed and developed is immersed in the pretreatment liquid is −2.0% by mass or more. The mass change rate is a value calculated by Expression: Mass change rate (% by mass)={(W1−W0)/W0}×100. W1 is the mass of the resist layer after a laminated body including a resist layer 3 and a copper foil is immersed in the pretreatment liquid at the pretreatment temperature for 30 minutes.
1 . A method for producing a wiring board, comprising:
forming a resist layer on a metal layer provided on a support body;
forming a pattern including an opening to which the metal layer is exposed on the resist layer by exposing and developing the resist layer;
pretreating a surface of the metal layer exposed into the opening by bringing the surface into contact with a pretreatment liquid at a predetermined pretreatment temperature; and
forming a copper plating layer on the metal layer by electrolytic plating, in this order,
wherein the resist layer and the pretreatment liquid are selected such that a mass change rate of the resist layer when the resist layer before being exposed and developed is immersed in the pretreatment liquid is −2.0% by mass or more, the mass change rate is a value calculated by the following expression:
Mass change rate (% by mass)={( W 1− W 0)/ W 0}×100,
W0 is a mass of the resist layer before being immersed in the pretreatment liquid, and W1 is a mass of the resist layer after a laminated body including the resist layer and a copper foil covering entire one surface of the resist layer is immersed in the pretreatment liquid at the pretreatment temperature for 30 minutes, and
the pretreatment liquid is an acidic pretreatment liquid containing alcohol, a content of the alcohol being 0.2 to 5% by mass on the basis of a mass of the pretreatment liquid, and
wherein an average height Rc of the surface of the metal layer on the copper plating layer side is 0.7 to 1.3 μm.
2 . The method according to claim 1 , wherein arithmetic surface roughness Ra of the surface of the metal layer is 0.20 to 0.30 μm.
3 . The method according to claim 1 , wherein the copper plating layer includes a linear portion having a width of 5 to 20 μm.
4 . The method according to claim 1 , wherein the metal layer is a layer provided on the support body by electroless plating.
5 . The method according to claim 1 , wherein the content of the alcohol is 0.6 to 0.7% by mass on the basis of the mass of the pretreatment liquid.