Patent Assignment
Reel/Frame 063224/0651
Assignment of Assignor's Interest
Recorded: 2023-04-05
Pages: 7
Assignors
TOGASAKI, KEI
Executed: 2023-03-22
IWASHITA, KENICHI
Executed: 2023-03-21
ONO, KEISHI
Executed: 2023-03-22
NARITA, MAO
Executed: 2023-03-22
MITSUKURA, KAZUYUKI
Executed: 2023-03-22
TOBA, MASAYA
Executed: 2023-03-22
Assignee
RESONAC CORPORATION
13-9, SHIBA DAIMON 1-CHOME, MINATO-KU, TOKYO, 105-8518, JAPAN
Covered Property
(1)
Method for Producing Wiring Board, and Wiring Board
Application:
18/044,789 →
Publication:
US 2024/0015889
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.