Adhesion removal method and film-forming method
Provided are an adhesion removal method capable of removing sulfur-containing adhesions that adhere onto the inner surface of a chamber or the inner surface of a pipe connected to the chamber without disassembly of the chamber and a film-forming method. Sulfur-containing adhesions adhering onto at least one of the inner surface of a chamber ( 10 ) and the inner surface of a discharge pipe ( 15 ) connected to the chamber ( 10 ) are removed by reaction with a cleaning gas containing a fluorine-containing compound gas.
1 . An adhesion removal method comprising:
reacting a sulfur-containing adhesion with a cleaning gas to form a sulfur fluoride gas, the sulfur-containing adhesion adhering onto at least one of an inner surface of a chamber and an inner surface of a pipe connected to the chamber, thereby removing the sulfur-containing adhesion,
wherein the cleaning gas consists of fluorine gas and an inert gas, and
wherein the cleaning gas is brought into contact with the adhesion in a condition of a temperature of 350° C. to 800° C. and a pressure of 20 Pa to 101 kPa.
2 . A film-forming method comprising:
a passivation step of supplying a passivation gas containing a sulfur-containing compound gas to a chamber in which a substrate is stored and reacting the substrate with the passivation gas to form a passivation film on a surface of the substrate; and
an adhesion removal step of removing a sulfur-containing adhesion adhering onto at least one of an inner surface of the chamber and an inner surface of a pipe connected to the chamber after the passivation step, wherein
the adhesion removal step is performed by the adhesion removal method according to claim 1 .
3 . The adhesion removal method according to claim 1 , wherein the inert gas is nitrogen gas.
4 . The film-forming method according to claim 2 , wherein the sulfur-containing compound gas is hydrogen sulfide gas.
5 . The film-forming method according to claim 2 , wherein the inert gas is nitrogen gas.