IP Library Granted Patent US 12,365,815
Granted Patent B2
US 12,365,815 · App. 18/323,867 · Granted Jul 22, 2025

Polishing liquid, polishing liquid set, polishing method, and defect suppression method

Inventors: Hisato Takahashi (Tokyo, JP); Masayuki Hanano (Tokyo, JP); Toshio Takizawa (Tokyo, JP)
Assignee: Resonac Corporation
C09G1/02C08K3/22C08K3/36C08K5/3412C08K5/3462C08L33/02C08L33/04C08L71/02C08K2003/2213H01L21/02068
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Quick Facts
Patent No.
US 12,365,815
App. No.
18/323,867
Granted
Jul 22, 2025
Kind
B2
Abstract

A polishing liquid includes abrasive grains containing at least one selected from the group consisting of cerium oxide and silicon oxide; a nitrogen-containing compound; and water. The nitrogen-containing compound contains nicotinamide. A polishing liquid set includes constituent components of a polishing liquid stored while being divided into a first liquid and a second liquid. A polishing method includes a step of polishing a surface to be polished by using a polishing liquid.

Claims (28)

1. A polishing liquid comprising: abrasive grains; a nitrogen-containing compound; and water, wherein

a content of cerium oxide is 90% by mass or more based on the whole of the abrasive grains contained in the polishing liquid,

the nitrogen-containing compound contains nicotinamide, and

the polishing liquid includes the nicotinamide in an amount of 0.01% by mass to 10% by mass based on the total mass of the polishing liquid.

2. The polishing liquid according to claim 1 , wherein a content of the abrasive grains is 0.1 to 1% by mass.

3. The polishing liquid according to claim 1 , further comprising a polymer compound (A) having at least one selected from the group consisting of a carboxylic acid group and a carboxylate group.

4. The polishing liquid according to claim 3 , wherein the polymer compound (A) contains at least one selected from the group consisting of a polymer and a salt thereof, and

the polymer is obtained by polymerizing a monomer containing at least one selected from the group consisting of acrylic acid and methacrylic acid.

5. The polishing liquid according to claim 3 , wherein a weight average molecular weight of the polymer compound (A) is 1000 to 5000.

6. The polishing liquid according to claim 3 , wherein a content of the polymer compound (A) is 0.1 to 1% by mass.

7. The polishing liquid according to claim 1 , further comprising a nonionic polymer compound (B).

8. The polishing liquid according to claim 7 , wherein the nonionic polymer compound (B) contains a polyoxyalkylene derivative.

9. The polishing liquid according to claim 7 , wherein the nonionic polymer compound (B) contains a polyoxyalkylene polyglyceryl ether.

10. The polishing liquid according to claim 7 , wherein the nonionic polymer compound (B) contains polyoxyethylene polyoxypropylene glycol ether.

11. The polishing liquid according to claim 7 , wherein a weight average molecular weight of the nonionic polymer compound (B) is 500 to 5000.

12. The polishing liquid according to claim 7 , wherein a content of the nonionic polymer compound (B) is 0.01 to 0.1% by mass.

13. The polishing liquid according to claim 1 , wherein a pH is 4.0 to 7.5.

14. The polishing liquid according to claim 1 , wherein a pH is more than 4.0.

15. A polishing liquid set comprising:

constituent components of the polishing liquid according to claim 1 stored while being divided into a first liquid and a second liquid,

the first liquid containing the abrasive grains and water,

the second liquid containing the nitrogen-containing compound and water.

16. A polishing method comprising a step of polishing a surface to be polished by using the polishing liquid according to claim 1 .

17. The polishing method according to claim 16 , wherein the surface to be polished contains amorphous silicon.

18. A polishing liquid comprising: abrasive grains; a nitrogen-containing compound; and water, wherein

a content of silicon oxide is 95% by mass or more based on the whole abrasive grains contained in the polishing liquid, and

the nitrogen-containing compound contains nicotinamide, and

the polishing liquid includes the nicotinamide in an amount of 0.01% by mass to 10% by mass based on the total mass of the polishing liquid.

Assignments (1)
CHANGE OF ADDRESS Recorded Feb 9, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066547/0677 →