Photosensitive resin composition, method for producing patterned cured film, patterned cured film and semiconductor element
The present disclosure relates a photosensitive resin composition containing (A) an alkali-soluble resin having an imide bond and a phenolic hydroxyl group and (B) a compound that generates acid by light, a patterned cured film using the photosensitive resin composition, a method for producing a patterned cured film, and a semiconductor element.
1 . A photosensitive resin composition comprising: (A) an alkali-soluble resin having an imide bond and a phenolic hydroxyl group; and (B) a compound that generates acid by light,
wherein the alkali-soluble resin (A) is a resin having:
a bisphenolimide skeleton derived from at least one selected from the group consisting of a compound represented by the following Formula (I), a compound represented by the following Formula (II), and a compound represented by the following Formula (III):
wherein R1, R2, R3, R4, R5, and R6 each independently represent a hydrogen atom or a methyl group; and Ra and Rb each independently represent an ether bond, a thioether bond, a carbonyl group, an alkylene group having 1 to 3 carbon atoms, or a single bond, and
a structural unit derived from bis(methoxymethyl) biphenyl or dimethoxymethylbenzene.
2 . The photosensitive resin composition according to claim 1 , wherein the bisphenolimide skeleton is derived from a compound represented by the following Formula (1), (2), (3), (4), (5), or (6):
wherein Ra and Rb each independently represent an ether bond, a thioether bond, a carbonyl group, an alkylene group having 1 to 3 carbon atoms, or a single bond.
3 . The photosensitive resin composition according to claim 1 , wherein the compound that generates acid by light is an o-quinone diazide compound.
4 . The photosensitive resin composition according to claim 1 , further comprising (C) a compound capable of undergoing a crosslinking reaction by heat.
5 . The photosensitive resin composition according to claim 4 , wherein the compound capable of undergoing a crosslinking reaction by heat is a compound having an alkoxy group or an epoxy group.
6 . The photosensitive resin composition according to claim 1 , further comprising (D) an elastomer.
7 . The photosensitive resin composition according to claim 1 , further comprising (E) an adhesive aid.
8 . The photosensitive resin composition according to claim 7 , wherein the adhesive aid is a nitrogen-containing aromatic compound.
9 . A method for producing a patterned cured film, the method comprising:
a step of applying and drying the photosensitive resin composition according to claim 1 on a portion or the entire surface of a substrate and forming a resin film;
a step of exposing a portion or the entire surface of the resin film;
a step of developing the resin film after exposure by means of an alkali aqueous solution to form a patterned resin film; and
a step of heating the patterned resin film.
10 . A patterned cured film having a pattern, the pattern including a cured product of the photosensitive resin composition according to claim 1 .
11 . A semiconductor element comprising the patterned cured film according to claim 10 as an interlayer insulating layer or a surface protective layer.