Patent Assignment
Reel/Frame 062157/0601
Assignment of Assignor's Interest
Recorded: 2022-12-20
Pages: 3
Assignors
AOKI, YU
Executed: 2022-10-31
SUZUKI, TERUAKI
Executed: 2022-10-31
HASHIMOTO, MASAHIRO
Executed: 2022-10-31
Assignee
SHOWA DENKO MATERIALS CO., LTD.
9-2, MARUNOUCHI 1-CHOME, CHIYODA-KU, TOKYO, 100-6606, JAPAN
Covered Property
(1)
Photosensitive Resin Composition, Method for Producing Patterned Cured Film, Patterned Cured Film and Semiconductor Element
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.