IP Library › Assignment 063857/0089
Patent Assignment
Reel/Frame 063857/0089

Change of Name

Recorded: 2023-06-05 Pages: 11
Assignor
SHOWA DENKO MATERIALS CO., LTD.
Executed: 2023-01-01
Assignee
RESONAC CORPORATION
13-9, SHIBA DAIMON 1-CHOME, MINATO-KU, TOKYO, 105-8518, JAPAN
Covered Properties (2)
Photosensitive Resin Composition, Method for Producing Patterned Cured Film, Patterned Cured Film and Semiconductor Element
Application: 18/011,025 →
Publication: US 2023/0236508
Surface Analysis Method, Surface Analysis System, and Surface Analysis Program
Application: 18/012,546 →
Publication: US 2023/0273237
Related Assignments (3)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Dec 20, 2022
From: AOKI, YU; SUZUKI, TERUAKI; HASHIMOTO, MASAHIRO
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 062157/0601 →
Assignment of Assignor's Interest Feb 13, 2023
From: ARAI, YUKI
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 062670/0109 →
Change of Address Feb 9, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066547/0677 →