Patent Assignment
Reel/Frame 062670/0109
Assignment of Assignor's Interest
Recorded: 2023-02-13
Pages: 2
Assignor
ARAI, YUKI
Executed: 2023-01-23
Assignee
SHOWA DENKO MATERIALS CO., LTD.
9-2, MARUNOUCHI 1-CHOME, CHIYODA-KU, TOKYO, 100-6606, JAPAN
Covered Property
(1)
Surface Analysis Method, Surface Analysis System, and Surface Analysis Program
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.