Resin composition, polishing pad, and method for producing polishing pad
Provided are: a resin composition for easily giving polishing pads which have a hardness suitable for chemical mechanical polishing and have voids of a desired size; a polishing pad produced from the resin composition; and a method for producing the polishing pad. The resin composition comprises a urethane (meth)acrylate (A), at least one unsaturated resin (B) selected from among vinyl ester resins and unsaturated polyester resins, an ethylenically unsaturated compound (C) which has an ethylenically unsaturated bond and is neither the urethane (meth)acrylate (A) nor the unsaturated resin (B), and a hollow object (D), wherein the mass ratio of the content of the urethane (meth)acrylate (A) to the content of the unsaturated resin (B), A:B, is 64:36 to 96:4 and the content of the hollow object (D) is 0.7-9.0 parts by mass per 100 parts by mass of the sum of the urethane (meth)acrylate (A), the unsaturated resin (B), and the ethylenically unsaturated compound (C).
1. A resin composition comprising:
a urethane (meth)acrylate (A),
an unsaturated resin (B) consisting of at least one of a vinyl ester resin and an unsaturated polyester resin,
an ethylenically unsaturated compound (C) having an ethylenically unsaturated bond and excluding the urethane (meth)acrylate (A) and the unsaturated resin (B), and
a hollow body (D),
wherein the urethane (meth)acrylate (A) is represented by the following general formula,
wherein R 1 is H or CH 3 , R 2 is a divalent hydrocarbon group which may contain an ether bond and in which a hydrogen atom may be substituted with a substituent, R 3 is a divalent hydrocarbon group, and R 4 is a structural unit derived from a polyester polyol having a weight-average molecular weight of 2,000 to 8,000, and n, which is the number of repeating units, is an average value based on the number of the entire urethane (meth)acrylate (A) contained in the resin composition and is a real number of 1.00 or greater,
wherein a mass ratio A:B of the content of the urethane (meth)acrylate (A) and the content of the unsaturated resin (B) is 64:36 to 96:4,
wherein the content of the hollow body (D) with respect to 100 parts by mass of the total of the urethane (meth)acrylate (A), the unsaturated resin (B) and the ethylenically unsaturated compound (C) is 0.7 to 9.0 parts by mass,
wherein the value of n in the general formula is 1.00 to 6.00, and
wherein the unsaturated resin (B) is an epoxy (meth)acrylate having a weight-average molecular weight of 1,000 to 6,000, or an unsaturated polyester resin having a weight-average molecular weight of 6,000 to 35,000.
2. The resin composition according to claim 1 , wherein the hollow body (D) is a resin balloon.
3. The resin composition according to claim 1 , wherein the content of the ethylenically unsaturated compound (C) is 40 to 200 parts by mass with respect to 100 parts by mass of the total of the urethane (meth)acrylate (A) and the unsaturated resin (B).
4. The resin composition according to claim 1 , wherein R2in the general formula is an alkylene group having 2 to 6 carbon atoms.
5. The resin composition according to claim 1 , wherein R 3 in the general formula is a cycloalkylene group or arylene group having 5 to 15 carbon atoms.
6. The resin composition according to claim 1 , wherein the polyester polyol in R 4 of the general formula is a condensation product of an aliphatic glycol and an aliphatic dibasic acid.
7. The resin composition according to claim 1 , wherein the unsaturated resin (B) is an epoxy (meth)acrylate.
8. The resin composition according to claim 1 , wherein the resin composition comprises an inorganic filler excluding the hollow body (D).
9. The resin composition according to claim 8 , wherein the content of the inorganic filler with respect to 100 parts by mass of the total of the urethane (meth)acrylate (A), the unsaturated resin (B), and the ethylenically unsaturated compound (C) is 10 to 200 parts by mass.
10. The resin composition according to claim 1 , wherein the resin composition is a resin composition for a polishing pad.
11. A polishing pad comprising a cured product of a resin composition described in claim 1 .
12. A method for producing a polishing pad comprising the steps of molding and curing a resin composition described in claim 1 , and scraping a surface of the cured resin composition.
13. The resin composition according to claim 1 , wherein the ethylenically unsaturated compound (C) is styrene.
14. The resin composition according to claim 8 , wherein the inorganic filler is calcium carbonate, aluminum hydroxide or a combination thereof.
15. The resin composition according to claim 1 , further comprising a curing agent and a curing accelerator.