RESIN COMPOSITION FOR MOLDING AND ELECTRONIC COMPONENT DEVICE
A resin composition for molding and an electronic component device are provided. The resin composition for molding includes: a curable resin; and an inorganic filler including a calcium titanate particle.
1 . A resin composition for molding comprising:
a curable resin; and
an inorganic filler containing calcium titanate particles.
2 . The resin composition for molding according to claim 1 , further comprising:
a curing agent,
wherein the curable resin includes an epoxy resin.
3 . The resin composition for molding according to claim 2 ,
wherein the curing agent includes an active ester compound.
4 . The resin composition for molding according to claim 2 ,
wherein the curing agent includes an active ester compound and at least one of other curing agents selected from the group consisting of a phenol curing agent, an amine curing agent, an acid anhydride curing agent, a polymercaptan curing agent, a polyaminoamide curing agent, an isocyanate curing agent, and a blocked isocyanate curing agent.
5 . The resin composition for molding according to claim 2 ,
wherein the curing agent includes an aralkyl-type phenol resin and an active ester compound.
6 . The resin composition for molding according to claim 1 ,
wherein the inorganic filler further includes another inorganic filler which is at least one selected from the group consisting of silica particles and alumina particles.
7 . The resin composition for molding according to claim 6 ,
wherein the other inorganic filler has a volume average particle diameter of 3 μm or more.
8 . The resin composition for molding according to claim 1 ,
wherein a content of the calcium titanate particles is 30% by volume to 80% by volume with respect to all the inorganic fillers.
9 . The resin composition for molding according to claim 1 ,
wherein relative dielectric constants of all the inorganic fillers at 10 GHz is 80 or less.
10 . The resin composition for molding according to claim 1 ,
wherein a total content of the inorganic fillers is 40% by volume to 85% by volume with respect to the entire resin composition for molding.
11 . The resin composition for molding according to claim 1 ,
wherein the calcium titanate particles have a volume average particle diameter of 0.2 μm to 80 μm.
12 . The resin composition for molding according to claim 1 , further comprising:
a curing promoter containing organic phosphine.
13 . The resin composition for molding according to claim 1 ,
wherein the inorganic fillers contain spherical calcium titanate particles.
14 . The resin composition for molding according to claim 13 ,
wherein a total content of the inorganic fillers is 70% by volume to 85% by volume with respect to the entire resin composition for molding.
15 . The resin composition for molding according to claim 1 ,
wherein a cured product of the resin composition for molding has a relative dielectric constant of 9 to 40 and a dielectric loss tangent of 0.020 or less.
16 . The resin composition for molding according to claim 1 , which is used in a high frequency device.
17 . The resin composition for molding according to claim 16 , which is used for sealing an electronic component in a high-frequency device.
18 . The resin composition for molding according to claim 1 , which is used in an antenna-in-package.
19 . An electronic component device comprising:
a support member;
an electronic component placed on the support member; and
a cured product of the resin composition for molding according to claim 1 , which seals the electronic component.
20 . The electronic component device according to claim 19 ,
wherein the electronic component includes an antenna.