Patent Assignment
Reel/Frame 063848/0680
Assignment of Assignor's Interest
Recorded: 2023-06-04
Pages: 8
Assignors
SUKEGAWA, YUTA
Executed: 2023-05-16
YAMAUCHI, ARISA
Executed: 2023-05-16
TANAKA, MIKA
Executed: 2023-05-16
HIRAI, TOMOKI
Executed: 2023-05-12
NOGUCHI, YUJI
Executed: 2023-05-12
KONDO, YUSUKE
Executed: 2023-05-12
ARATA, MICHITOSHI
Executed: 2023-05-16
YAMAURA, MASASHI
Executed: 2023-05-12
NAKAYAMA, AYUMI
Executed: 2023-05-12
Assignee
RESONAC CORPORATION
13-9, SHIBA DAIMON 1-CHOME, MINATO-KU,, TOKYO, 105-8518, JAPAN
Covered Property
(1)
Resin Composition for Molding and Electronic Component Device
Application:
18/039,957 →
Publication:
US US20240034833A1
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.