MOLDING RESIN COMPOSITION AND ELECTRONIC COMPONENT DEVICE
A molding resin composition includes: an epoxy resin; a curing agent; and an inorganic filler containing at least one selected from the group consisting of calcium titanate particles and strontium titanate particles, in which a total content of the calcium titanate particles and the strontium titanate particles is 60% by volume to 80% by volume with respect to a total amount of the inorganic filler.
1 . A molding resin composition comprising:
an epoxy resin;
a curing agent; and
an inorganic filler containing at least one selected from the group consisting of calcium titanate particles and strontium titanate particles,
wherein a total content of the calcium titanate particles and the strontium titanate particles is 60% by volume to 80% by volume with respect to a total amount of the inorganic filler.
2 . The molding resin composition according to claim 1 ,
wherein the total content of the calcium titanate particles and the strontium titanate particles is 65% by volume to or more with respect to the total amount of the inorganic filler.
3 . The molding resin composition according to claim 1 ,
wherein the inorganic filler contains calcium titanate particles, and
wherein the content of the calcium titanate particles is 60% by volume to 80% by volume with respect to the total amount of the inorganic filler.
4 . The molding resin composition according to claim 1 ,
wherein the curing agent includes an active ester compound.
5 . The molding resin composition according to claim 1 ,
wherein the inorganic filler further contains at least one selected from the group consisting of silica particles and alumina particles.
6 . The molding resin composition according to claim 1 ,
wherein a relative dielectric constant of the total amount of the inorganic filler at 10 GHz is 80 or less.
7 . The molding resin composition according to claim 1 ,
wherein a content of the total amount of the inorganic filler is 40% by volume to 85% by volume with respect to the entire molding resin composition.
8 . The molding resin composition according to claim 1 , which is used in a high frequency device.
9 . The molding resin composition according to claim 1 , which is used in an antenna-in-package.
10 . An electronic component device comprising:
a support member;
an electronic component placed on the support member; and
a cured product of the molding resin composition according to claim 1 which seals the electronic component.
11 . The electronic component device according to claim 10 ,
wherein the electronic component includes an antenna.