Patent Assignment
Reel/Frame 063987/0800
Assignment of Assignor's Interest
Recorded: 2023-06-19
Pages: 8
Assignors
YAMAURA, MASASHI
Executed: 2023-06-05
ARATA, MICHITOSHI
Executed: 2023-06-06
NAKAYAMA, AYUMI
Executed: 2023-06-05
KONDOH, YUSUKE
Executed: 2023-06-05
NOGUCHI, YUJI
Executed: 2023-06-05
Assignee
RESONAC CORPORATION
13-9, SHIBA DAIMON 1-CHOME, MINATO-KU,, TOKYO, 105-8518, JAPAN
Covered Property
(1)
Molding Resin Composition and Electronic Component Device
Application:
18/265,971 →
Publication:
US 2024/0026118
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.