IP Library Granted Patent US 12,018,189
Granted Patent B2
US 12,018,189 · App. 17/428,823 · Granted Jun 25, 2024

Composition for adhesives, outer package material for electricity storage devices, and method for producing same

Inventors: Kazuhiko Oga (Tokyo, JP); Takeshi Kawamoto (Tokyo, JP); Kai Suzuki (Tokyo, JP); Ryunosuke Yamamoto (Tokyo, JP)
Assignee: Resonac Corporation
C09J7/29B32B7/12B32B15/085B32B15/20B32B27/32C09J7/38H01M50/197B32B2255/06B32B2255/26B32B2457/10C09J2203/33C09J2301/16C09J2400/163C09J2475/00
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 12,018,189
App. No.
17/428,823
Granted
Jun 25, 2024
Kind
B2
Abstract

Provided are an outer package material that is for electricity storage devices such as batteries and has such a sufficient anti-electrolytic solution property that the time-dependent reduction of the adhesive strength between a metal foil layer and a sealant layer by an electrolytic solution is suppressed over a long time and a composition for adhesives for giving the outer package material. In an outer package material that is for electricity storage devices and has a structure in which at least a base material layer, a first adhesive layer, a metal foil layer, a second adhesive layer, and a sealant layer are stacked in sequence, a composition containing an isocyanato group and a (meth) acryloyl group and further containing an acid-modified polyolefin (component 1), an active energy ray polymerization initiator (component 3), and a solvent (component 4) is used as a composition for adhesives to form the second adhesive layer.

Claims (36)

1. A composition for adhesives, the composition being used to form a second adhesive layer in an outer package material for electricity storage devices, the outer package material having a structure in which at least a base material layer, a first adhesive layer, a metal foil layer, the second adhesive layer, and a sealant layer are stacked in sequence, the composition comprising an isocyanato group, a (meth)acryloyl group, a component 1, a component 3, and a component 4, wherein

the component 1 is an acid-modified polyolefin, the component 3 is an active energy ray polymerization initiator, and the component 4 is a solvent.

2. A composition for adhesives, the composition being used to form a second adhesive layer in an outer package material for electricity storage devices, the outer package material having a structure in which at least a base material layer, a first adhesive layer, a metal foil layer, the second adhesive layer, and a sealant layer are stacked in sequence, the composition comprising a component 1, a component 2, a component 3; and a component 4, wherein

the component 1 is an acid-modified polyolefin, the component 2 is a compound having an isocyanato group and a (meth)acryloyl group in a molecule, the component 3 is an active energy ray polymerization initiator, and the component 4 is a solvent.

3. The composition for adhesives according to claim 2 , wherein the component 2 is a reaction product by reaction of an isocyanato group of an isocyanurate-modified product of a diisocyanate compound with an alcoholic hydroxy group of a (meth)acryloyl-containing compound having the alcoholic hydroxy group.

4. The composition for adhesives according to claim 2 , wherein a total number of isocyanato groups and (meth)acryloyl groups in a molecule of the component 2 is 3 or more.

5. The composition for adhesives according to claim 2 , further comprising a component 5, wherein

the component 5 is a compound having a plurality of isocyanato groups in a molecule, the compound being other than the component 2.

6. The composition for adhesives according to claim 2 , further comprising a component 6, wherein

the component 6 is a compound having a plurality of radically polymerizable functional groups in a molecule, the compound being other than the component 2.

7. The composition for adhesives according to claim 6 , wherein the radically polymerizable functional group is a (meth)acryloyl group.

8. The composition for adhesives according to claim 1 , wherein the component 1 is a maleic anhydride-modified polyolefin.

9. The composition for adhesives according to claim 1 , wherein the component 1 is an acid-modified product of a copolymer of propylene and an olefin other than propylene.

10. The composition for adhesives according to claim 1 , wherein the component 1 has a melting point of 75° C. or more and 90° C. or less.

11. The composition for adhesives according to claim 1 , further comprising a component 7, wherein the component 7 is a reaction catalyst for facilitating a reaction of an isocyanato group.

12. The composition for adhesives according to claim 1 , wherein a ratio of a total number of isocyanato groups to a total number of (meth)acryloyl groups contained in the composition for adhesives is 3.0 or more and 15.0 or less.

13. The composition for adhesives according to claim 1 , wherein a proportion of an amount of the component 1 is 60% by mass or more and 96% by mass or less where an amount calculated by subtracting a total amount of the component 3 and the component 4 from a total amount of the composition for adhesives is 100% by mass, and a proportion of an amount of the component 3 is 0.05% by mass or more and 10% by mass or less where an amount calculated by subtracting an amount of the component 4 from the total amount of the composition for adhesives is 100% by mass.

14. The composition for adhesives according to claim 1 , wherein a proportion of an amount of the component 1 is 56% by mass or more and 92% by mass or less, a proportion of an amount of the component 3 is 0.05% by mass or more and 10% by mass or less, and a proportion of an amount calculated by subtracting an amount of the component 1, the component 3, and the component 4 from a total amount of the composition for adhesives is 4% by mass or more and 50% by mass or less where an amount calculated by subtracting an amount of the component 4 from a total amount of the composition for adhesives is 100% by mass.

15. The composition for adhesives according to claim 1 , wherein a proportion of an amount of the component 4 is 75% by mass or more and 95% by mass or less where a total amount of the composition for adhesives is 100% by mass.

16. An outer package material for electricity storage devices, the outer package material having a structure in which at least a base material layer, a first adhesive layer, a metal foil layer, a second adhesive layer, and a sealant layer are stacked in sequence, wherein

the second adhesive layer includes a polymer of the composition for adhesives according to claim 1 .

17. The outer package material for electricity storage devices according to claim 16 , wherein a corrosion prevention treatment layer is provided on at least a face of the metal foil layer proximate to the sealant layer, and the sealant layer includes a polyolefin resin.

18. A method for producing an outer package material for electricity storage devices, the outer package material having a structure in which at least a base material layer, a first adhesive layer, a metal foil layer, a second adhesive layer, and a sealant layer are stacked in sequence, the method comprising:

applying the composition for adhesives according to claim 1 onto one or both of a face of the metal foil layer proximate to the sealant layer and a face of the sealant layer proximate to the metal foil layer;

partially or completely removing the solvent from the applied composition for adhesives; and then

polymerizing the composition for adhesives from which the solvent has been partially or completely removed, by irradiation with an active energy ray, to form a polymer layer as the second adhesive layer.

19. A method for producing an outer package material for electricity storage devices, the outer package material having a structure in which at least a base material layer, a first adhesive layer, a metal foil layer, a second adhesive layer, and a sealant layer are stacked in sequence, a corrosion prevention treatment layer being provided on at least a face of the metal foil layer proximate to the sealant layer, the sealant layer including a polyolefin resin, the method comprising:

applying the composition for adhesives according to claim 1 onto one or both of a face of the metal foil layer proximate to the sealant layer and a face of the sealant layer proximate to the metal foil layer;

partially or completely removing the solvent from the applied composition for adhesives; then

polymerizing the composition for adhesives from which the solvent has been partially or completely removed, by irradiation with an active energy ray, to form a polymer layer as the second adhesive layer; and then

exposing the polymer layer to an atmosphere at 30° C. or more and 70° C. or less for 1 hour or more.

20. A method for producing an outer package material for electricity storage devices, the outer package material having a structure in which at least a base material layer, a first adhesive layer, a metal foil layer, a second adhesive layer, and a sealant layer are stacked in sequence, a corrosion prevention treatment layer being provided on at least a face of the metal foil layer proximate to the sealant layer, the sealant layer including a polyolefin resin, the method comprising:

applying the composition for adhesives according to claim 2 onto one or both of a face of the metal foil layer proximate to the sealant layer and a face of the sealant layer proximate to the metal foil layer;

partially or completely removing the solvent from the applied composition for adhesives; then

polymerizing the composition for adhesives from which the solvent has been partially or completely removed, by irradiation with an active energy ray, to form a polymer layer as the second adhesive layer; and then

exposing the polymer layer to an atmosphere at 30° C. or more and 70° C. or less for 1 hour or more.

Assignments (3)
CHANGE OF ADDRESS Recorded Feb 9, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066547/0677 →
CHANGE OF NAME Recorded Jun 23, 2023
From: SHOWA DENKO K.K.
To: RESONAC CORPORATION
Reel/Frame 064082/0513 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 5, 2021
From: OGA, KAZUHIKO; KAWAMOTO, TAKESHI; SUZUKI, KAI; YAMAMOTO, RYUNOSUKE
To: SHOWA DENKO K.K.
Reel/Frame 057095/0824 →