FILM-LIKE ADHESIVE AGENT, DICING/DIE-BONDING ALL-IN-ONE FILM, SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING SAME
Disclosed is a film-shaped adhesive. An embodiment of the film-shaped adhesive contains metal particles and has a shear viscosity at 110° C. of 30000 Pa·s or less. Another embodiment of the film-shaped adhesive contains metal particles and has a loss modulus at 110° C. of 200 kPa or less. Another embodiment of the film-shaped adhesive contains metal particles, a thermosetting resin, a curing agent, and an elastomer, in which a content of the metal particles based on the total amount of the metal particles, thermosetting resin, curing agent, and elastomer is 70.0% by mass or more, and a total content of the thermosetting resin and the curing agent is 13.0% by mass or more.
1 . A film-shaped adhesive comprising metal particles,
wherein the film-shaped adhesive has a shear viscosity at 110° C. of 30000 Pa·s or less.
2 . The film-shaped adhesive according to claim 1 ,
wherein the film-shaped adhesive has a loss modulus at 110° C. of 200 kPa or less.
3 . A film-shaped adhesive comprising metal particles,
wherein the film-shaped adhesive has a loss modulus at 110° C. of 200 kPa or less.
4 . The film-shaped adhesive according to claim 1 ,
wherein the film-shaped adhesive further comprises a thermosetting resin, a curing agent, and an elastomer, and
a content of the metal particles is 70.0% by mass or more based on a total amount of the metal particles, the thermosetting resin, the curing agent, and the elastomer.
5 . The film-shaped adhesive according to claim 1 ,
wherein the film-shaped adhesive further comprises a thermosetting resin, a curing agent, and an elastomer, and
a content of the metal particles is 20.0% by volume or more based on a total amount of the metal particles, the thermosetting resin, the curing agent, and the elastomer.
6 . A film-shaped adhesive comprising:
metal particles;
a thermosetting resin;
a curing agent; and
an elastomer,
wherein based on a total amount of the metal particles, the thermosetting resin, the curing agent, and the elastomer,
a content of the metal particles is 70.0% by mass or more, and
a total content of the thermosetting resin and the curing agent is 13.0% by mass or more.
7 . The film-shaped adhesive according to claim 1 ,
wherein the metal particles are conductive particles.
8 . The film-shaped adhesive according to claim 1 ,
wherein the metal particles are silver particles.
9 . A dicing-die bonding integrated film comprising, in the following order:
a base material layer;
a pressure-sensitive adhesive layer; and
a bonding adhesive layer formed from the film-shaped adhesive according to claim 1 .
10 . A semiconductor device comprising:
a semiconductor chip;
a support member having the semiconductor chip mounted thereon; and
a bonding adhesive member provided between the semiconductor chip and the support member and adhering the semiconductor chip and the support member,
wherein the bonding adhesive member is a cured product of the film-shaped adhesive according to claim 1 .
11 . A method for manufacturing a semiconductor device, the method comprising:
sticking a semiconductor wafer to the bonding adhesive layer of the dicing-die bonding integrated film according to claim 9 ;
producing a plurality of singulated adhesive piece-attached semiconductor chips by dicing the semiconductor wafer with the bonding adhesive layer stuck thereto; and
adhering the adhesive piece-attached semiconductor chips on a support member, with the adhesive piece interposed therebetween.