Patent Assignment
Reel/Frame 064235/0324
Assignment of Assignor's Interest
Recorded: 2023-07-13
Pages: 12
Assignors
KURODA, TAKAHIRO
Executed: 2023-06-26
HIRAMOTO, YUYA
Executed: 2023-06-19
KAMONO, MEGUMI
Executed: 2023-06-20
TANIGUCHI, KOHEI
Executed: 2023-06-20
AKIYAMA, YUYA
Executed: 2023-06-14
ITAGAKI, KEI
Executed: 2023-06-08
Assignee
RESONAC CORPORATION
13-9, SHIBA DAIMON 1-CHOME, MINATO-KU, TOKYO, 105-8518, JAPAN
Covered Property
(1)
Film-Like Adhesive Agent, Dicing/Die-Bonding All-in-One Film, Semiconductor Device, and Method for Manufacturing Same
Application:
18/258,891 →
Publication:
US 2024/0043722
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.