Granted Patent B2

US 12,560,867 · App. 18/020,874 · Granted Feb 24, 2026

Inventors: Yosuke Kaguchi (Tokyo, JP); Akiko Takeda (Tokyo, JP); Masakazu Kume (Tokyo, JP)

Assignee: RESONAC CORPORATION

G03F7/11

Abstract

Claims (14)

1 . A photosensitive element comprising:

a support film;

a photosensitive layer provided on one surface of the support film; and

a protective film provided on a surface of the photosensitive layer opposite to the support film, wherein

the protective film has a weld line on a surface opposite to the photosensitive layer, and a width of the weld line is 45 to 300 μm.

2 . The photosensitive element according to claim 1 , wherein the protective film is a polyethylene film.

3 . The photosensitive element according to claim 1 , wherein a height of the weld line is 0.10 to 3.0 μm.

4 . A method for producing a photosensitive element, the method comprising:

a step of forming a photosensitive layer on a support film using a photosensitive resin composition; and

a step of bonding a winding outer surface of a protective film having a roll shape onto the photosensitive layer, wherein

the protective film has a weld line in a longitudinal direction of a winding inner surface, and a width of the weld line is 45 to 300 μm.

5 . The method for producing a photosensitive element according to claim 4 , wherein the protective film is a polyethylene film.

6 . The method for producing a photosensitive element according to claim 5 , wherein a height of the weld line is 0.10 to 3.0 μm.

7 . The method for producing a photosensitive element according to claim 4 , wherein a height of the weld line is 0.10 to 3.0 μm.

Assignments (2)

Continuity (1)

References Cited (13)