SiC substrate and SiC epitaxial wafer

1. A SiC substrate,

wherein, in a case where a point 10 mm inside from an outer peripheral edge in a [11-20] direction from a center is defined as a first outer peripheral point and any point within a circle having a diameter of 10 mm from the center is defined as a first center point,

a tensile stress of the first outer peripheral point in a <1-100> direction, which is a circumferential direction of the first outer peripheral point, is larger than a tensile stress of the first center point in the <1-100> direction, which is the same direction as the circumferential direction of the first outer peripheral point,

the tensile stress of the first outer peripheral point in the circumferential direction of the first outer peripheral point is larger than the tensile stress of the first center point acting in the same direction as the circumferential direction of the first outer peripheral point by 10 MPa or more, and

the tensile stress is calculated as a product of a strain and a Young's modulus, the strain is obtained by (a 0 −a)/a 0 , a 0 is a reference lattice constant, and a is a lattice constant obtained by an X-ray diffraction method.

2. The SiC substrate according to claim 1 ,

wherein, in a case where a point 10 mm inside from the outer peripheral edge in a [−1100]direction from the center is defined as a second outer peripheral point,

a tensile stress of the second outer peripheral point in a <11-20> direction, which is the same direction as a circumferential direction of the second outer peripheral point, is larger than a tensile stress of the first center point in the <11-20> direction, which is the same direction as the circumferential direction of the second outer peripheral point.

3. A SiC substrate,

wherein, in a case where a point 10 mm inside from an outer peripheral edge in a [−1100]direction from a center is defined as a second outer peripheral point and any point within a circle having a diameter of 10 mm from the center is defined as a first center point,

a tensile stress of the second outer peripheral point in a <11-20> direction, which is a circumferential direction of the second outer peripheral point, is larger than a tensile stress of the first center point in the <11-20> direction, which is the same direction as the circumferential direction of the second outer peripheral point,

the tensile stress of the second outer peripheral point in the circumferential direction of the second outer peripheral point is larger than the tensile stress of the first center point acting in the same direction as the circumferential direction of the second outer peripheral point by 10 MPa or more, and

the tensile stress is calculated as a product of a strain and a Young's modulus, the strain is obtained by (a 0 −a)/a 0 , a 0 is a reference lattice constant, and a is a lattice constant obtained by an X-ray diffraction method.

4. The SiC substrate according to claim 3 ,

wherein, in a case where a point 10 mm inside from the outer peripheral edge in a [11-20]direction from the center is defined as a first outer peripheral point,

a tensile stress of the first outer peripheral point in a <1-100> direction, which is the same direction as a circumferential direction of the first outer peripheral point, is larger than a tensile stress of the first center point in the <1-100> direction, which is the same direction as the circumferential direction of the first outer peripheral point.

5. The SiC substrate according to claim 1 ,

wherein the tensile stress of the first outer peripheral point in the circumferential direction of the first outer peripheral point is larger than the tensile stress of the first center point acting in the same direction as the circumferential direction of the first outer peripheral point by 30 MPa or more.

6. The SiC substrate according to claim 2 ,

wherein the tensile stress of the second outer peripheral point in the circumferential direction of the second outer peripheral point is larger than the tensile stress of the first center point acting in the same direction as the circumferential direction of the second outer peripheral point by 10 MPa or more.

7. The SiC substrate according to claim 1 ,

wherein a diameter is 145 mm or more.

8. The SiC substrate according to claim 1 ,

wherein the diameter is 195 mm or more.

9. The SiC substrate according to claim 1 ,

wherein a first surface has a surface roughness (Ra) of 1 nm or less.

10. The SiC substrate according to claim 1 ,

wherein a warp is 50 μm or less.

11. The SiC substrate according to claim 1 ,

wherein, in a first surface, in a case where supports are positioned to overlap with a circumference on 7.5 mm inside from an outermost periphery and a plane connecting parts overlapping with the supports when seen in a thickness direction is defined as a reference plane, a bow is 30 μm or less.

12. The SiC substrate according to claim 2 ,

wherein the tensile stress of the second outer peripheral point in the circumferential direction of the second outer peripheral point is larger than the tensile stress of the first center point acting in the same direction as the circumferential direction of the second outer peripheral point by 30 MPa or more.

13. The SiC substrate according to claim 2 ,

wherein the diameter is 195 mm or more.

14. The SiC substrate according to claim 3 ,

wherein the diameter is 195 mm or more.

15. The SiC substrate according to claim 4 ,

wherein the diameter is 195 mm or more.

16. The SiC substrate according to claim 5 ,

wherein the diameter is 195 mm or more.

17. The SiC substrate according to claim 6 ,

wherein the diameter is 195 mm or more.

18. The SiC substrate according to claim 9 ,

wherein the diameter is 195 mm or more.

19. The SiC substrate according to claim 10 ,

wherein the diameter is 195 mm or more.

20. The SiC substrate according to claim 11 ,

wherein the diameter is 195 mm or more.

21. The SiC substrate according to claim 11 ,

wherein the diameter is 195 mm or more.