Patent Assignment
Reel/Frame 063504/0590
Assignment of Assignor's Interest
Recorded: 2023-05-02
Pages: 5
Assignors
SUO, HIROMASA
Executed: 2023-04-27
KINDAICHI, RIMPEI
Executed: 2023-04-27
YAMASHITA, TAMOTSU
Executed: 2023-04-27
Assignee
RESONAC CORPORATION
13-9, SHIBA DAIMON 1-CHOME, MINATO-KU, TOKYO, 105-8518, JAPAN
Covered Property
(1)
SiC SUBSTRATE AND SiC EPITAXIAL WAFER
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.