Adhesion removal method and film-forming method
Provided are an adhesion removal method capable of removing sulfur-containing adhesions that adhere onto the inner surface of a chamber or the inner surface of a pipe connected to the chamber without disassembly of the chamber and a film-forming method. Sulfur-containing adhesions adhering onto at least one of the inner surface of a chamber ( 10 ) and the inner surface of a discharge pipe ( 15 ) connected to the chamber ( 10 ) are removed by reaction with a cleaning gas containing an oxygen-containing compound gas.
1. A film-forming method comprising:
a passivation step of supplying a passivation gas containing a sulfur-containing compound gas to a chamber in which a substrate is stored and reacting the substrate with the passivation gas to form a passivation film on a surface of the substrate; and
an adhesion removal step of removing a sulfur-containing adhesion adhering onto at least one of an inner surface of the chamber and an inner surface of a pipe connected to the chamber after the passivation step, wherein
the adhesion removal step comprises reacting the sulfur-containing adhesion with a cleaning gas containing an oxygen-containing compound gas, wherein the cleaning gas contains neither a sulfur-containing compound nor a halogen-containing compound.
2. The film-forming method according to claim 1 , wherein the sulfur-containing compound gas is hydrogen sulfide gas.
3. The film-forming method according to claim 1 , wherein the cleaning gas is brought into contact with the adhesion in a condition of a temperature of 20° C. or more and 800° C. or less and a pressure of 20 Pa or more and 101 kPa or less.
4. The film-forming method according to claim 1 , wherein the oxygen-containing compound gas is at least one selected from the group consisting of oxygen gas, nitrogen monoxide, nitrous oxide, and carbon monoxide.
5. The film-forming method according to claim 1 , wherein the oxygen-containing compound gas is oxygen gas.
6. An adhesion removal method comprising:
reacting a sulfur-containing adhesion with a cleaning gas containing an oxygen-containing compound gas, the sulfur-containing adhesion adhering onto at least one of an inner surface of a chamber and an inner surface of a pipe connected to the chamber, thereby removing the sulfur-containing adhesion,
wherein the cleaning gas contains neither a sulfur-containing compound nor a halogen-containing compound.
7. The adhesion removal method according to claim 6 , wherein the oxygen-containing compound gas is at least one selected from the group consisting of oxygen gas, nitrogen monoxide, nitrous oxide, and carbon monoxide.
8. The adhesion removal method according to claim 6 , wherein the oxygen-containing compound gas is oxygen gas.
9. The adhesion removal method according to claim 6 , wherein the cleaning gas is brought into contact with the adhesion in a condition of a temperature of 20° C. or more and 800° C. or less and a pressure of 20 Pa or more and 101 kPa or less.
10. The adhesion removal method according to claim 9 , wherein the oxygen-containing compound gas is at least one selected from the group consisting of oxygen gas, nitrogen monoxide, nitrous oxide, and carbon monoxide.
11. The adhesion removal method according to claim 9 , wherein the oxygen-containing compound gas is oxygen gas.