IP Library Granted Patent US 12,104,009
Granted Patent B2
US 12,104,009 · App. 16/971,307 · Granted Oct 1, 2024

Epoxy resin, epoxy resin composition, epoxy resin cured product and method of producing epoxy resin cured product, composite material, insulating member, electronic appliance, structural material, and vehicle

Inventors: Kazumasa Fukuda (Tokyo, JP); Yoshitaka Takezawa (Tokyo, JP); Tomoko Higashiuchi (Tokyo, JP); Naoki Maruyama (Tokyo, JP); Shingo Tanaka (Tokyo, JP)
Assignee: RESONAC CORPORATION
C08G59/226C08G59/245C08G59/28C08J5/04C08K5/0025C08G2250/00
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 12,104,009
App. No.
16/971,307
Granted
Oct 1, 2024
Kind
B2
Abstract

(1) An epoxy resin, which is configured to form, in a cured product of the epoxy resin, a phase-separated structure that is formed from at least two phases, wherein at least one phase of the at least two phases includes a liquid crystal structure and (2) An epoxy resin, which is configured to form a phase-separated structure in a cured product, the cured product being obtained by curing the epoxy resin by increasing a temperature of the epoxy resin from an ambient temperature to a curing temperature at a rate of not greater than 20° C./minute.

Claims (18)

1. An epoxy resin, which is configured to form, in a cured product of the epoxy resin, a phase-separated structure that is formed from at least two phases, wherein at least one phase of the at least two phases includes a liquid crystal structure, the epoxy resin comprising:

a liquid crystal epoxy compound A and a multimer thereof, and

an epoxy compound B, the epoxy compound B having a different structure from a structure of the liquid crystal epoxy compound A,

wherein the epoxy compound B is an epoxy compound that forms a different liquid crystal structure from a liquid crystal structure formed by the liquid crystal compound A or is an epoxy compound that does not form a liquid crystal structure, and

wherein the epoxy compound B comprises a biphenyl epoxy compound or a bisphenol epoxy compound.

2. The epoxy resin according to claim 1 , wherein the at least one phase includes a smectic structure or a nematic structure as the liquid crystal structure.

3. The epoxy resin according to claim 1 , wherein the liquid crystal epoxy compound A has a mesogenic structure.

4. The epoxy resin according to claim 1 , wherein the liquid crystal epoxy compound A is represented by the following Formula (A):

wherein, in Formula (A), X represents a linking group that includes at least one selected from the group consisting of divalent groups in the following Group (I), each Y independently represents an aliphatic hydrocarbon group having 1 to 8 carbon atoms, an alkoxy group having 1 to 8 carbon atoms, a fluorine atom, a chlorine atom, a bromine atom, an iodine atom, a cyano group, a nitro group or an acetyl group, and each n independently represents an integer from 0 to 4:

wherein, in Group (I), each Y independently represents an aliphatic hydrocarbon group having 1 to 8 carbon atoms, an alkoxy group having 1 to 8 carbon atoms, a fluorine atom, a chlorine atom, a bromine atom, an iodine atom, a cyano group, a nitro group or an acetyl group, each n independently represents an integer from 0 to 4, k represents an integer from 0 to 7, m represents an integer from 0 to 8, and 1 represents an integer from 0 to 12.

5. The epoxy resin according to claim 1 , wherein the liquid crystal epoxy compound A is represented by the following Formula (M):

wherein, in Formula (M), each of R 1 to R 4 independently represents a hydrogen atom or an alkyl group having 1 to 3 carbon atoms.

6. An epoxy resin composition, comprising the epoxy resin according to claim 1 , and a curing agent.

7. An epoxy resin, which is configured to form, in a cured product of the epoxy resin, a phase-separated structure that is formed from at least two phases, wherein at least one phase of the at least two phases includes a liquid crystal structure, the epoxy resin comprising:

a liquid crystal epoxy compound A and a multimer thereof, and

an epoxy compound B, the epoxy compound B having a different structure from a structure of the liquid crystal epoxy compound A,

wherein the epoxy compound B is an epoxy compound that forms a different liquid crystal structure from a liquid crystal structure formed by the liquid crystal compound A or is an epoxy compound that does not form a liquid crystal structure, and

wherein the at least one phase includes a smectic structure as the liquid crystal structure, and at least one other phase of the at least two phases includes a nematic structure as the liquid crystal structure.

Assignments (5)
CHANGE OF ADDRESS Recorded Feb 9, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066547/0677 →
CORRECTIVE ASSIGNMENT TO CORRECT THE ASSIGNEE'S ADDRESS PREVIOUSLY RECORDED AT REEL: 063042 FRAME: 0725. ASSIGNOR(S) HEREBY CONFIRMS THE CHANGE OF NAME. Recorded Apr 17, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 063349/0537 →
CHANGE OF NAME Recorded Mar 21, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 063042/0725 →
CHANGE OF NAME Recorded Mar 17, 2023
From: HITACHI CHEMICAL COMPANY, LTD.
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 063015/0964 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 6, 2020
From: FUKUDA, KAZUMASA; TAKEZAWA, YOSHITAKA; HIGASHIUCHI, TOMOKO; MARUYAMA, NAOKI; TANAKA, SHINGO
To: HITACHI CHEMICAL COMPANY, LTD.
Reel/Frame 053980/0027 →