Patent Assignment
Reel/Frame 063349/0537
Corrective Assignment to Correct the Assignee's Address Previously Recorded at Reel: 063042 Frame: 0725. Assignor(S) Hereby Confirms the Change of Name.
Recorded: 2023-04-17
Pages: 13
Assignor
SHOWA DENKO MATERIALS CO., LTD.
Executed: 2023-01-01
Assignee
RESONAC CORPORATION
13-9, SHIBA DAIMON 1-CHOME, MINATO-KU, TOKYO, JAPAN
Covered Properties
(2)
Epoxy Resin, Epoxy Resin Composition, Epoxy Resin Cured Product, and Composite Material
Epoxy Resin, Epoxy Resin Composition, Epoxy Resin Cured Product and Method of Producing Epoxy Resin Cured Product, Composite Material, Insulating Member, Electronic Appliance, Structural Material, and Vehicle
Related Assignments
(5)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Oct 6, 2020
From: MARUYAMA, NAOKI; HIGASHIUCHI, TOMOKO; FUKUDA, KAZUMASA; KATAGI, HIDEYUKI
To: HITACHI CHEMICAL COMPANY, LTD.
Reel/Frame 053980/0020 →
Assignment of Assignor's Interest
Oct 6, 2020
From: FUKUDA, KAZUMASA; TAKEZAWA, YOSHITAKA; HIGASHIUCHI, TOMOKO; MARUYAMA, NAOKI
To: HITACHI CHEMICAL COMPANY, LTD.
Reel/Frame 053980/0027 →
Change of Name
Mar 17, 2023
From: HITACHI CHEMICAL COMPANY, LTD.
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 063015/0964 →
Change of Name
Mar 21, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 063042/0725 →
Change of Address
Feb 9, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066547/0677 →