Patent Assignment
Reel/Frame 063015/0964
Change of Name
Recorded: 2023-03-17
Pages: 11
Assignor
HITACHI CHEMICAL COMPANY, LTD.
Executed: 2020-10-01
Assignee
SHOWA DENKO MATERIALS CO., LTD.
9-2, MARUNOUCHI 1-CHOME, CHIYODA-KU, TOKYO, JAPAN
Covered Properties
(2)
Epoxy Resin, Epoxy Resin Composition, Epoxy Resin Cured Product, and Composite Material
Epoxy Resin, Epoxy Resin Composition, Epoxy Resin Cured Product and Method of Producing Epoxy Resin Cured Product, Composite Material, Insulating Member, Electronic Appliance, Structural Material, and Vehicle
Related Assignments
(5)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Oct 6, 2020
From: MARUYAMA, NAOKI; HIGASHIUCHI, TOMOKO; FUKUDA, KAZUMASA; KATAGI, HIDEYUKI
To: HITACHI CHEMICAL COMPANY, LTD.
Reel/Frame 053980/0020 →
Assignment of Assignor's Interest
Oct 6, 2020
From: FUKUDA, KAZUMASA; TAKEZAWA, YOSHITAKA; HIGASHIUCHI, TOMOKO; MARUYAMA, NAOKI
To: HITACHI CHEMICAL COMPANY, LTD.
Reel/Frame 053980/0027 →
Change of Name
Mar 21, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 063042/0725 →
Corrective Assignment to Correct the Assignee's Address Previously Recorded at Reel: 063042 Frame: 0725. Assignor(S) Hereby Confirms the Change of Name.
Apr 17, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 063349/0537 →
Change of Address
Feb 9, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066547/0677 →