Epoxy resin, epoxy resin composition, epoxy resin cured product, and composite material
An epoxy resin, comprising an epoxy compound having two or more mesogenic structures, and having a loss tangent of 1 or more at 35° C. before curing.
1. An epoxy resin, comprising an epoxy compound having two or more mesogenic structures, and having a loss tangent of 1 or more at 35° C. before curing,
wherein the epoxy compound has a structure represented by the following Formula (1-B):
wherein, in Formula (1-B), each of R 1 and R 2 independently represents an alkyl group having 1 to 8 carbon atoms; X represents a single bond or a linking group that includes at least one divalent group selected from the following Group (A); each Y independently represents an aliphatic hydrocarbon group having 1 to 8 carbon atoms, an alkoxy group having 1 to 8 carbon atoms, a fluorine atom, a chlorine atom, a bromine atom, an iodine atom, a cyano group, a nitro group or an acetyl group; each Z independently represents —O— or —NH—; each m independently represents an integer from 0 to 4; and each n independently represents an integer from 0 to 4:
wherein, in Group (A), each Y independently represents an aliphatic hydrocarbon group having 1 to 8 carbon atoms, an alkoxy group having 1 to 8 carbon atoms, a fluorine atom, a chlorine atom, a bromine atom, an iodine atom, a cyano group, a nitro group or an acetyl group; k represents an integer from 0 to 7; l represents an integer from 0 to 12; m represents an integer from 0 to 8; and each n independently represents an integer from 0 to 4.
2. The epoxy resin according to claim 1 , wherein the epoxy compound has a structure represented by the following Formula (2-B);
3. The epoxy resin according to claim 1 , wherein at least one of the two or more mesogenic structures has a structure represented by at least one of Formula (3) or Formula (4):
wherein, in Formula (3) and Formula (4), each of R 3 to R 6 independently represents a hydrogen atom or an alkyl group having 1 to 3 carbon atoms.
4. The epoxy resin according to claim 1 , wherein the epoxy compound has two mesogenic structures and a divalent biphenyl group that is disposed between the two mesogenic structures.
5. The epoxy resin according to claim 1 , further comprising a mesogenic epoxy monomer represented by the following Formula (1-m):
wherein, in Formula (1-m), X represents a single bond or a linking group that includes at least one divalent group selected from the following Group (A); each Y independently represents an aliphatic hydrocarbon group having 1 to 8 carbon atoms, an alkoxy group having 1 to 8 carbon atoms, a fluorine atom, a chlorine atom, a bromine atom, an iodine atom, a cyano group, a nitro group or an acetyl group; and each n independently represents an integer from 0 to 4:
wherein, in Group (A), each Y independently represents an aliphatic hydrocarbon group having 1 to 8 carbon atoms, an alkoxy group having 1 to 8 carbon atoms, a fluorine atom, a chlorine atom, a bromine atom, an iodine atom, a cyano group, a nitro group or an acetyl group; k represents an integer from 0 to 7; l represents an integer from 0 to 12; m represents an integer from 0 to 8; and each n independently represents an integer from 0 to 4.
6. The epoxy resin according to claim 5 , wherein the mesogenic epoxy monomer comprises an epoxy compound represented by the following Formula (2-m):
7. The epoxy resin according to claim 5 , wherein the mesogenic epoxy monomer comprises an epoxy compound represented by the following Formula (3-m) or Formula (4-m):
wherein, in Formula (3-m) and Formula (4-m), each of R 3 to R 6 independently represents a hydrogen atom or an alkyl group having 1 to 3 carbon atoms.
8. The epoxy resin according to claim 5 , wherein a mass concentration, obtained by liquid chromatography, of the mesogenic epoxy monomer is not greater than 50% of the total mass concentration of the epoxy resin.
9. An epoxy resin composition, comprising the epoxy resin according to claim 1 and a curing agent.
10. The epoxy resin composition according to claim 9 , wherein the curing agent comprises a compound having two or more amino groups that are directly bonded to an aromatic ring.
11. The epoxy resin composition according to claim 9 , wherein the curing agent comprises 3,3′-diaminodiphenylsulfone.
12. An epoxy resin cured product, which is obtained by curing the epoxy resin composition according to claim 9 .
13. A composite material, comprising the epoxy resin cured product according to claim 12 and a reinforcing material.
14. The composite material according to claim 13 , wherein the reinforcing material comprises a carbon material.