IP Library Assignment 053980/0020
Patent Assignment
Reel/Frame 053980/0020

Assignment of Assignor's Interest

Recorded: 2020-10-06 Pages: 5
Assignors
MARUYAMA, NAOKI
Executed: 2020-08-26
HIGASHIUCHI, TOMOKO
Executed: 2020-08-26
FUKUDA, KAZUMASA
Executed: 2020-08-26
KATAGI, HIDEYUKI
Executed: 2020-09-07
NAKAMURA, YUKI
Executed: 2020-09-08
TAKEZAWA, YOSHITAKA
Executed: 2020-08-26
Assignee
HITACHI CHEMICAL COMPANY, LTD.
9-2, MARUNOUCHI 1-CHOME, CHIYODA-KU, TOKYO, 100-6606, JAPAN
Covered Property (1)
Epoxy Resin, Epoxy Resin Composition, Epoxy Resin Cured Product, and Composite Material
Application: 16/970,955 →
Publication: US 2020/0392282
Related Assignments (4)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name Mar 17, 2023
From: HITACHI CHEMICAL COMPANY, LTD.
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 063015/0964 →
Change of Name Mar 21, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 063042/0725 →
Corrective Assignment to Correct the Assignee's Address Previously Recorded at Reel: 063042 Frame: 0725. Assignor(S) Hereby Confirms the Change of Name. Apr 17, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 063349/0537 →
Change of Address Feb 9, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066547/0677 →