Patent Assignment
Reel/Frame 053980/0027
Assignment of Assignor's Interest
Recorded: 2020-10-06
Pages: 5
Assignors
FUKUDA, KAZUMASA
Executed: 2020-08-26
TAKEZAWA, YOSHITAKA
Executed: 2020-08-26
HIGASHIUCHI, TOMOKO
Executed: 2020-08-26
MARUYAMA, NAOKI
Executed: 2020-08-26
TANAKA, SHINGO
Executed: 2020-08-27
Assignee
HITACHI CHEMICAL COMPANY, LTD.
9-2, MARUNOUCHI 1-CHOME, CHIYODA-KU, TOKYO, 100-6606, JAPAN
Covered Property
(1)
Epoxy Resin, Epoxy Resin Composition, Epoxy Resin Cured Product and Method of Producing Epoxy Resin Cured Product, Composite Material, Insulating Member, Electronic Appliance, Structural Material, and Vehicle
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name
Mar 17, 2023
From: HITACHI CHEMICAL COMPANY, LTD.
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 063015/0964 →
Change of Name
Mar 21, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 063042/0725 →
Corrective Assignment to Correct the Assignee's Address Previously Recorded at Reel: 063042 Frame: 0725. Assignor(S) Hereby Confirms the Change of Name.
Apr 17, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 063349/0537 →
Change of Address
Feb 9, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066547/0677 →