Thermal conduction sheet holder and method of manufacturing heat dissipating device
A thermal conduction sheet holder include, in the following order, an elongated carrier film, a plurality of thermal conduction sheets, and an elongated cover film covering the plurality of thermal conduction sheets, the shortest distance between adjacent thermal conduction sheets is 2 mm or more, the plurality of thermal conduction sheets are disposed at intervals in a longitudinal direction of the carrier film and the cover film, and the plurality of thermal conduction sheets are peelable from the cover film and the carrier film.
1. A thermal conduction sheet holder, comprising, in the following order:
an elongated carrier film;
a plurality of release layers disposed along a longitudinal direction of the carrier film;
a plurality of thermal conduction sheets;
an elongated cover film covering the plurality of thermal conduction sheets, wherein:
a shortest distance between adjacent thermal conduction sheets is 2 mm or more,
the plurality of thermal conduction sheets are disposed at intervals in the longitudinal direction of the carrier film and the cover film, and the plurality of thermal conduction sheets are peelable from the cover film and the carrier film,
one or more of the thermal conduction sheets are disposed on each of the plurality of release layers, and
the plurality of thermal conduction sheets are peelable from the carrier film via the plurality of release layers.
2. The thermal conduction sheet holder according to claim 1 , wherein, when the cover film is disposed at a lower side in a vertical direction and the carrier film is disposed at an upper side in the vertical direction, a shape of a gap formed by adjacent release layers, and adjacent thermal conduction sheets respectively disposed on the adjacent release layers, is convex when viewed from a width direction of the thermal conduction sheet holder.
3. The thermal conduction sheet holder according to claim 1 , wherein a peel force between the carrier film and the plurality of thermal conduction sheets is larger than a peel force between the cover film and the thermal conduction sheet.
4. The thermal conduction sheet holder according to claim 1 , wherein an average thickness of the plurality of thermal conduction sheets is from 50 μm to 500 μm.
5. The thermal conduction sheet holder according to claim 1 , wherein the plurality of thermal conduction sheets contain a thermal conduction filler and a resin.
6. The thermal conduction sheet holder according to claim 1 , which is configured to be taken up along a longitudinal direction of the thermal conduction sheet holder in a roll shape.
7. The thermal conduction sheet holder according to claim 1 , wherein a width of the carrier film and a width of the cover film are larger than a width of the plurality of thermal conduction sheets in a width direction perpendicular to the longitudinal direction of the carrier film and the cover film.
8. The thermal conduction sheet holder according to claim 1 , wherein a notch is not generated on a surface of the carrier film.
9. A method of manufacturing a heat dissipating device obtained by using the thermal conduction sheet holder according to claim 1 , and interposing a thermal conduction sheet between a heat generator and a heat dissipator, the method comprising:
providing the thermal conduction sheet holder according to claim 1 ;
peeling the cover film from the thermal conduction sheet holder;
pressure bonding one of the plurality of thermal conduction sheets to one of the heat generator or the heat dissipator;
peeling the carrier film from the thermal conduction sheet to which the one of the heat generator or the heat dissipator is adhered; and
pressure bonding the other of the heat generator or the heat dissipator to an opposite side of the thermal conduction sheet from the side at which the one of the heat generator or the heat dissipator is bonded.