Patent Assignment
Reel/Frame 063927/0440
Assignment of Assignor's Interest
Recorded: 2023-06-13
Pages: 3
Assignors
KOBUNE, MIKA
Executed: 2023-06-01
YAJIMA, MICHIAKI
Executed: 2023-05-31
SUGA, KEITA
Executed: 2023-05-31
Assignee
RESONAC CORPORATION
13-9, SHIBA DAIMON 1-CHOME, MINATO-KU, TOKYO, 105-8518, JAPAN
Covered Property
(1)
Thermal Conduction Sheet Holder and Method of Manufacturing Heat Dissipating Device
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.