IP Library Granted Patent US 12,545,862
Granted Patent B2
US 12,545,862 · App. 17/774,025 · Granted Feb 10, 2026

Method for producing decomposing/cleaning composition

Inventors: Susumu Nakazaki (Tokyo, JP); Kuniaki Miyahara (Tokyo, JP)
Assignee: Resonac Corporation
C11D7/3263C11D7/263C11D2111/18
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Quick Facts
Patent No.
US 12,545,862
App. No.
17/774,025
Granted
Feb 10, 2026
Kind
B2
Abstract

Provided is a method for producing a decomposing/cleaning composition which improves etching speed retention. In particular, a method for producing a decomposing/cleaning composition which contains (A) an N-substituted amide compound in which a hydrogen atom is not directly bonded to a nitrogen atom and (B) a quaternary alkyl ammonium fluoride or a hydrate thereof is provided, the method having a preparation step for mixing the (A) and (B) components in an inert gas atmosphere.

Claims (31)

1 . A method for producing a decomposing cleaning composition comprising (A) an N-substituted amide compound in which no hydrogen atom is directly bonded to a nitrogen atom, and (B) a quaternary alkylammonium fluoride or a hydrate thereof, the method comprising:

a preparation step of mixing the (A) and the (B) under an inert gas atmosphere, and

an encapsulation step of enclosing the prepared decomposing cleaning composition in a container under an inert gas atmosphere after the preparation step.

2 . The method for producing the decomposing cleaning composition according to claim 1 , wherein the decomposing cleaning composition further comprises (C) an ether compound, and wherein the method comprises a preparation step of mixing the (A) to the (C) under an inert gas atmosphere, and an encapsulation step of enclosing the prepared decomposing cleaning composition in a container under an inert gas atmosphere after the preparation step.

3 . The method for producing the decomposing cleaning composition according to claim 1 , wherein the inert gas in the preparation step is nitrogen gas.

4 . The method for producing the decomposing cleaning composition according to claim 2 , wherein the (C) ether compound comprises a dialkyl ether of glycol selected from diethylene glycol dimethyl ether, dipropylene glycol dimethyl ether, tripropylene glycol dimethyl ether, tripropylene glycol diethyl ether, tripropylene glycol di(n-butyl) ether, tetraethylene glycol dimethyl ether, and tetrapropylene glycol dimethyl ether.

5 . The method for producing the decomposing cleaning composition according to claim 1 , wherein the inert gas in the encapsulation step is nitrogen gas.

6 . The method for producing the decomposing cleaning composition according to claim 1 , wherein the (A) N-substituted amide compound is a 2-pyrrolidone derivative compound represented by formula (1):

wherein, in formula (1), R 1 represents an alkyl group having 1 to 4 carbon atoms.

7 . The method for producing the decomposing cleaning composition according to claim 6 , wherein the (A) N-substituted amide compound is a 2-pyrrolidone derivative compound wherein R 1 in formula (1) is a methyl group or an ethyl group.

8 . The method for producing the decomposing cleaning composition according to claim 2 , wherein the (C) ether compound comprises a dialkyl ether of glycol represented by formula (2):

R 2 O(C n H 2n O) x R 3   (2),

wherein, in formula (2), R 2 and R 3 each independently represent an alkyl group selected from the group consisting of a methyl group, an ethyl group, a propyl group, an isopropyl group, an n-butyl group, an isobutyl group, a sec-butyl group, and a t-butyl group, n is 2 or 3, and x is an integer of 1 to 4.

9 . The method for producing the decomposing cleaning composition according to claim 8 , wherein the dialkyl ether of glycol is dipropylene glycol dimethyl ether.

10 . The method for producing the decomposing cleaning composition according to claim 2 , wherein the (C) ether compound comprises a dialkyl ether represented by formula (3):

R 4 OR 5   (3),

wherein, in the formula, R 4 and R 5 each independently represent an alkyl group having 4 to 8 carbon atoms.

11 . The method for producing the decomposing cleaning composition according to claim 10 , wherein the dialkyl ether is dibutyl ether.

12 . The method for preparing the decomposing cleaning composition according to claim 1 , wherein the (B) quaternary alkylammonium fluoride is a tetraalkylammonium fluoride represented by R 6 R 7 R 8 R 9 N + F − , wherein R 6 to R 9 are each independently an alkyl group selected from the group consisting of a methyl group, an ethyl group, an n-propyl group, an isopropyl group, and an n-butyl group.

13 . The method for producing the decomposing cleaning composition according to claim 1 , wherein the decomposing cleaning composition is a decomposing cleaning composition for an adhesive polymer.

14 . The method for producing the decomposing cleaning composition according to claim 13 , wherein the adhesive polymer is a polyorganosiloxane compound.

15 . The method for producing the decomposing cleaning composition according to claim 2 , wherein the (A) N-substituted amide compound is a 2-pyrrolidone derivative compound represented by formula (1):

wherein, in formula (1), R 1 represents an alkyl group having 1 to 4 carbon atoms.

16 . The method for producing the decomposing cleaning composition according to claim 4 , wherein the (A) N-substituted amide compound is a 2-pyrrolidone derivative compound represented by formula (1):

wherein, in formula (1), R 1 represents an alkyl group having 1 to 4 carbon atoms.

17 . The method for producing the decomposing cleaning composition according to claim 8 , wherein the (C) ether compound comprises a dialkyl ether represented by formula (3):

R 4 OR 5   (3),

wherein, in the formula, R 4 and R 5 each independently represent an alkyl group having 4 to 8 carbon atoms.

18 . The method for producing the decomposing cleaning composition according to claim 4 , wherein the (C) ether compound comprises a dialkyl ether represented by formula (3):

R 4 OR 5   (3),

wherein, in the formula, R 4 and R 5 each independently represent an alkyl group having 4 to 8 carbon atoms.

Assignments (3)
CHANGE OF ADDRESS Recorded Feb 9, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066547/0677 →
CHANGE OF NAME Recorded Jun 23, 2023
From: SHOWA DENKO K.K.
To: RESONAC CORPORATION
Reel/Frame 064082/0513 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 3, 2022
From: NAKAZAKI, SUSUMU; MIYAHARA, KUNIAKI
To: SHOWA DENKO K.K.
Reel/Frame 059799/0771 →
Priority Claims (1)
JP 2019-212251 · Nov 25, 2019 · national
Continuity (1)
Related Publication 20220380704A1 · Dec 1, 2022
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