IP Library › Granted Patent US 12,717,233
Granted Patent B2
US 12,717,233 · App. 18/019,181 · Granted Aug 25, 2026

Photosensitive resin composition, photosensitive element, method for forming resist pattern, and method for producing printed wiring board

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Quick Facts
Patent No.
US 12,717,233
App. No.
18/019,181
Filed
Feb 1, 2023
Granted
Aug 25, 2026
Kind
B2
Art Unit
1737
USPC
430/287.1
Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 14, 2025
From: KATO, TETSUYA; TAKEDA, AKIKO
To: RESONAC CORPORATION
Reel/Frame 069853/0264 →
CHANGE OF ADDRESS Recorded Feb 9, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066547/0677 →
Priority Claims (1)
JP 2020-134944 · Aug 7, 2020 · national
Continuity (1)
Related Publication 20230273518A1 · Aug 31, 2023
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