Patent Assignment
Reel/Frame 069853/0264
Assignment of Assignor's Interest
Recorded: 2025-01-14
Pages: 2
Assignee
RESONAC CORPORATION
9-1, HIGASHI-SHIMBASHI, MINATO-KU, TOKYO, 105-7325, JAPAN
Covered Property
(1)
Photosensitive Resin Composition, Photosensitive Element, Method for Forming Resist Pattern, and Method for Producing Printed Wiring Board
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.