SiC single crystal, method of manufacturing SiC ingot, and method of manufacturing SiC wafer
View Patent ↗A SiC single crystal, wherein difference between the curving amount of the atomic arrangement surface on the cut surface cut along the <1-100> direction through the center in plan view and the curving amount of the atomic arrangement surface on the cut surface cut along the <11-20> direction that passes through the center of view and is perpendicular to the <1-100> direction is 60 μm or less.
1. A SiC single crystal, wherein the difference between the curving amount of the atomic arrangement surface on the cut surface cut along the <1-100> direction through the center in plan view and the curving amount of the atomic arrangement surface on the cut surface cut along the <11-20> direction that passes through the center of view and is perpendicular to the <1-100> direction is 60 μm or less.
2. The SiC single crystal according to claim 1 , wherein the difference between the maximum value and the minimum value of the curing amount of the atomic arrangement surface on each of the cut surfaces cut along the six sides rotated by 30° with respect to the [1-100] direction through the center in plan view is 60 μm or less.
3. The SiC single crystal according to claim 1 , wherein the atomic arrangement surfaces are curved in the same direction at any cut surface.
4. The SiC single crystal according to claim 1 , wherein the difference between the maximum value and the minimum value of the curving amount per unit length on the atomic arrangement surface is 4 μm/cm or less.
5. The SiC single crystal according to claim 1 , wherein the diameter of the SiC single crystal in plan view is 140 mm or more.
6. The SiC single crystal according to claim 1 , wherein the thickness of the SiC single crystal is 500 μm or more.
7. A method of manufacturing a SiC ingot, wherein the SiC single crystal according to claim 1 is used as a seed crystal, and a SiC single crystal is formed on C-plane ((000-1) plane) or a plane having an off angle of 0 to 10° from the C-plane of the seed crystal.
8. A method of manufacturing a SiC wafer, wherein a SiC ingot produced by the method for producing the SiC ingot according to claim 7 , is sliced.